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Removal of Static Electricity on Polyimide Film Surface by $O_2$ or Ar Cold Plasma Etching  

Lee, Jae-Ho (Department of Textile Engineering, Miryang National University)
Jeong, Hee-Cheon (School of Textiles, Yeungnam University)
Publication Information
Fibers and Polymers / v.5, no.2, 2004 , pp. 151-155 More about this Journal
Abstract
Cold plasma of $O_2$ or Ar was irradiated on hydrophobic Kapton surface to attenuate or remove the electrostatic potential. A measurement on charge dissipation speed clarifies the obscure effect of plasma. These consequences reveal that $O_2$ plasma etching is more effective than Ar plasma. After 30 days, the dissipation speed of accumulated charge on initially etched sample has not changed under summer season.
Keywords
Kapton; O$_2$ plasma; Ar plasma; Charge dissipation speed;
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Times Cited By Web Of Science : 7  (Related Records In Web of Science)
Times Cited By SCOPUS : 1
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1 K. Wong, X. Tao, C. Yuen, and K. Yeung, Textile Res. J., 69,846 (1999)   DOI
2 D. Wilson, H. D. Stenzenberger, and P. M. Hergenrother, 'Polyimides', p.228, Blackie & Son Ltd., Glasgow, 1990
3 K. L. Mittal, 'Polyimides: Synthesis, Characterization, and Applications', Vol. 1, p.837, Plenum Press, New York, 1984
4 J. A. Lee and D. L. Mykkanen, 'Metal and Polymer Matrix Composites', pp.181-185, Noyes Data Corp., New Jersey, 1987
5 M. I. Bessonov, M. M. Koton, V. V. Kudryavtsev, and L. A. Laius, 'Polyimides: Thermally Stable Polymers', p.272, Plenum Publishing, New York, 1987
6 D. Wilson, H. D. Stenzenberger, and P. M. Hergenrother, 'Polyimides', p.250, Blackie & Son Ltd., Glasgow, 1990
7 M. K. Ghosh and K. L. Mittal, 'Polyimides: Fundamentals and Applications', p.629, Marcel Dekker, Inc., New York, 1996
8 M. McCord, Y. Hwang, P. Hauser, Y. Qiu, J., Cuomo, O., Hankins, M. Bourham, and L. Canup, Textile Res. J., 72, 491 (2002)   DOI   ScienceOn
9 K. L. Mittal, 'Polyimides: Synthesis, Characterization, and Applications', Vol. 1, p.957, Plenum Press, New York, 1984
10 M. Chanda and S. K. Roy, 'Plastics Technology Handbook', p.10, Marcel Dekker Inc., New York, 1993
11 T. Yasuda, M. Gazicki, and H. Yasuda, J. Appl. Polym. Sci. Appl. Polym. Symp., 38, 201 (1984)
12 S. Y. lto, Polymer Finishing, Japan, 6,15 (1990)
13 Y. J. Hwang, J. S, An, M. G. McCord, S, W. Park, and B. C. Kang, J. Korean Fiber Soc., 37, 487 (2000)
14 C. Feger, M. M. Khojastech, and J. E. McGrath, 'Polyimides: Materials, Chemistry and Characterization', p.731, Elsevier Science Publishers B.V, Amsterdam, 1989
15 A. Grill, 'Cold Plasma in Materials Fabrication: From Fundamentals to Applications', p.160, IEEE PRESS, New York, 1993
16 A. J. Kinloch, 'Adhesion and Adhesives', p.8, Chapman and Hall Publisher Co., London, 1990
17 O. Fujiwara and K. Kawaguchi, Electronics and Communications in Japan (Part Ⅱ:Electronics), 83, 44 (2000)
18 Y. J. Hwang, J. S. An, M. G. McCord, S. W. Park, and B. C. Kang, Fiber Polym., 4, 145 (2003)   DOI   ScienceOn
19 D. Wilson, H. D. Stenzenberger, and P. M. Hergenrother, 'Polyimides', p.253, Blackie & Son Ltd., Glasgow, 1990
20 C. Feger, M. M. Khojastech, and J. E. McGrath, 'Polyimides: Materials, Chemistry and Characterization', p.719, Elsevier Science Publishers B.V, Amsterdam, 1989
21 K. Koo, K. Sato, B. G. Park, and S. Nori, SEN-I GAKKAISHI, 49, 137 (1993)   DOI   ScienceOn
22 R. Yosomiya, K Morimoto, A. Nakajima, Y Ikada, and T. Suzuki, 'Adhesion and Bonding in Composites', p.69, Marcel Dekker, Inc., New York, 1990
23 M. K. Ghosh and K. L. Mittal, 'Polyimides: Fundamentals and Applications', p.389, Marcel Dekker, Inc., New York, 1996
24 Y. Matsushita and N. Mori, T Sometani, Electrical Engineering in Japan, 127, 33 (1999)   DOI   ScienceOn
25 M. S. Kim and T. J. Kang, Fiber Polym., 2,152 (2001)
26 A. Grill, 'Cold Plasma in Materials Fabrication: From Fundamentals to Applications', p.238, IEEE PRESS, New York, 1993