[KSCI] Korea Science Citation Index Service

Micromachined Low-Loss Low-Dispersion Elevated CPW for High-Speed Interconnects

S. H. Jeong (Samsung Electronics Co. Ltd.)
Lee, S. N. (Department of Electrical and Electronics Eng., Yonsei University)
Lee, S. G. (Samsung Advanced Institute of Technology)
J. G. Yook (Department of Electrical and Electronics Eng., Yonsei University)
Kim, Y. J. (Department of Mechatronics eng., Yonsei University)
Park, H. K. (Department of Electrical and Electronics Eng., Yonsei University)

Publication Information

Journal of electromagnetic engineering and science / v.2, no.2, 2002 , pp. 59-64 More about this Journal

Abstract

In this paper, 10 $\mu$ m-elevated MEMS CPWs on various substrates are presented. Effective dielectric constants of elevated CPW(ECPW) on polyimide-loaded silicon or alumina substrate are examined and characteristic impedances are also computed versus elevation height. Dispersive property of ECPW and its electromagnetic field distributions are studied through 3-D FDTD algorithm for optimum design. Attenuation of ECPW is measured with TRL calibration procedure and revealed about 3.2 43 lower than that of conventional CPW on the same low-resistivity silicon at 40 CHz. ECPW on polyimide-loaded silicon with overlapped configuration reveals 0.2 dB/mm. Especially, alumina substrate imposes better attenuation than silicon.

Keywords

Elevated CPW; Low Loss; Low Dispersive; High-Speed Transmission Line;

Citations & Related Records

Reference

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