Coupling Performance Analysis of a Buried Meshed-Ground in a Multi-layered Structure

Since the manufacturing process in the LTCC process does not allow solid ground planes between ceramic layers to isolate the signal lines, the buried ground should be realized as a meshed ground plane. Both characteristic impedances of the signal lines and couplings between different signal layers are influenced by the properties of these meshed planes. In this paper, we propose a new analysis method for coupling behavior between internal transmission lines, which are isolated by the buried meshed-ground planes. The coupling behavior between layers isolated by meshed-ground planes is investigated by the coupled-transmission line model for the isolated layers. The coupling factors between isolated lines with the meshed-ground are extracted by 2-D FEM calculations.