[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.14773/cst.2019.18.3.73

Micro-scale Observation of Corrosion of Hot-Dip Aluminized 11% Cr Stainless Steel

Cho, Min-Seung (Department of Materials Science and Engineering, Chonnam National University)
Park, Choong-Nyeon (Department of Materials Science and Engineering, Chonnam National University)
Park, Chan-Jin (Department of Materials Science and Engineering, Chonnam National University)

Publication Information

Corrosion Science and Technology / v.18, no.3, 2019 , pp. 73-77 More about this Journal

Abstract

Hot-dip aluminized coating has been widely used to protect steel substrate against corrosion. In this study, the corrosion behavior of hot-dip aluminized type 409L (11% Cr) stainless steel (SS) was investigated using macro- and micro-scale polarization tests. An Al-Fe-Si alloy layer that was formed due to inter-diffusion of alloying elements between Al coating and SS substrate was observed between Al coating and 409L SS substrate. In both macro- and micro-scale polarization tests, the corrosion potential ( $E_{corr}$ ) of the 409L SS substrate was much nobler than that of the Al coating and alloy layer. $E_{corr}$ of the alloy layer was between that of Al coating and 409L SS substrate. This indicates that the alloy layer can act as a buffer between the more active Al coating and the nobler SS substrate for pit growth in aluminized SS. The presence of the alloy layer appears to be helpful in hindering pitting corrosion of aluminized SS.

Keywords

Aluminized stainless steel; Alloy layer; Micro-scale polarization; Pitting corrosion;

Citations & Related Records

Reference

1	M. D. Salgado, S. C. S. Rodrigues, D. M. Santos, A. S. Brandim, and V. F. C. Lins, Eng. Fail. Anal., 79, 89 (2017). DOI
2	M. -J. Kim, S. -I. Jang, S. -H. Woo, J. -G. Kim, and Y. -H. Kim, Corrosion, 71, 285 (2015). DOI
3	P. H. Han, Z. H. Xu, C. P. Wang, M. C. Li, and H. Y. Bi, Int. J. Electrochem. Sci., 9, 3784 (2014).
4	H. P. Kim and D. J. Kim, Corros. Sci. Tech., 17, 183 (2018).
5	W. -J. Beom, K. -S. Yun, C. -J Park, H. -J. Ryu, and Y. -H Kim, Corros. Sci., 52, 734 (2010). DOI
6	M. -J Kim, S. -H Woo, and J. -G Kim, Mater. Trans., 56, 1599 (2015). DOI
7	M. R. Bateni, P. Wei, O. Kesler, and A. Petric, Mater. Manuf. Process., 28, 1314 (2013). DOI
8	Y. X. Li, Q. Jia, Z. T. Zhu, W. Gao, and H. Chen, Surf. Rev. Lett., 24, 1750046 (2017). DOI
9	H. T. Zhang and J. K. Liu, Mat. Sci. Eng. A, 528, 19 (2011).
10	Y. -I. Choi, D. Paik, and C. -J. Park, ECS Electrochem. Lett., 1, C5 (2012). DOI