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http://dx.doi.org/10.5781/KWJS.2011.29.3.295

Cu Filling into TSV and Si Dice Stacking for 3 Dimension Packaging

Roh, Myong-Hoon (서울시립대학교)
Park, Sang-Yoon (서울시립대학교)
Kim, Won-Joong (서울시립대학교)
Jung, Jae-Pil (서울시립대학교)

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Journal of Welding and Joining / v.29, no.3, 2011 , pp. 39-44 More about this Journal

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Times Cited By KSCI : 1 (Citation Analysis)

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