| 1 |
I. Anjoh, A. Nishimura and S. Eguchi, IEEE Trans. Electron Devices, 45-3 (1998), 743
DOI
ScienceOn
|
| 2 |
D. Wojciechowski, J. Vanfleteren, E. Reese and H.-W. Hagedorn, Microelec. Relia., 40 (2000), 1215
|
| 3 |
Y. Li, K.-S. Moon, C. P. Wong, Science, 308-5727 (2005), 1419
|
| 4 |
C. F. Goh, H. Yu, S. S. Yong, S. G. Mhaisalkar, F. Y. C. Boey and P. S. T대, Mater. Sci. and Engineer. B, 117 (2005), 153
DOI
ScienceOn
|
| 5 |
K. S. Moon, J. Wu and C. P. Wong, IEEE Trans. Components and Packag. Technol., 26-2 (2003), 375
DOI
ScienceOn
|
| 6 |
J. M. Kim, K. Yasuda and K. Fujimoto, J. Elec. Mater., 33-11 (2004), 1331
|
| 7 |
M. J. Yim, J. Elecon. Mater., 33-1 (2004), 76
|
| 8 |
J. Kivilahti and P. Savolainen, J. Elec. Manufac., 5 (1995), 245
DOI
|
| 9 |
J. Liu (Eds.) : Conductive Adhesives for Electronics Packaging, Electrochemical Publications Ltd., 1999, 313
|
| 10 |
M. Abtew and G. Selvaduray, Mater. Sci. and Engineer. :R Rep., 27 (2000), 95
DOI
ScienceOn
|
| 11 |
H. J. Jiang, K.-S. Moon, J. Lu and C. P. Wong, J. Electron. Mater., 34 (2005), 1432
DOI
ScienceOn
|
| 12 |
J. Kolbe, A. Arp, F. Calderone, E. M. Meyer, W. Meyer, H. Schaefer and M. Stuve, Microelec, Relia., 47 (2007), 331
DOI
ScienceOn
|
| 13 |
M. Keil, B. Bjarnason, B. Wickstrom and L. Olsson, Adv. Packag., 10-9 (2001)
|
| 14 |
J. C. Jagt, P. J. M. Beris and G. F. C. M. Lijten, IEEE Trans. CPMT- Part B, 18-2 (1995), 292
|
| 15 |
J. Liu (Eds.) : Conductive Adhesives for Electronics Packaging, Electrochemical Publications Ltd., 1999, 36
|
| 16 |
K. Suganuma, Current Opinion in Solid State & Materials Science, 5 (2001), 55
DOI
ScienceOn
|
| 17 |
Y. Li, C. P. Wong, Mater. Sci. and Engineer. :R Rep., 51 (2006), 1
DOI
ScienceOn
|
| 18 |
H. P. Wu, X. J. Wu, M. Y. Ge, G. Q. Zhang, Y. W. Wang and J. Jiang, Composites Sci. and Technol., 67 (2007), 1182
DOI
ScienceOn
|
| 19 |
C. Gallagher, G. Matijasevic and J. F. Maguire, Proc. of 47th IEEE Electron, Compon. and Technol. Conf., (1997), 554
|
| 20 |
M. J. Yim, J. S. Hwang, W. S. Kwon, K. W. Jang and K. W. Paik, IEEE Trans. Electron. Packag. Manufac., 26-2 (2003), 150
|
| 21 |
M. J. Yim and K. W. Paik, Int. J. Adhesion & Adhesives, 26 (2006), 304
DOI
ScienceOn
|
| 22 |
H. P. Wu, J. F. Liu, X. J. Wu, M. Y. Ge, Y. W. Wang, G. Q. Zhang and J. Z. Jiang, Int. J. Adhesion & Adhesives, 26 (2006), 617
DOI
ScienceOn
|
| 23 |
J. Liu (Eds.) : Conductive Adhesives for Electronics Packaging, Electrochemical Publications Ltd., 1999, 153
|
| 24 |
J. H. Lau : Flip Chip Technology, McGraw Hill, 1996, 301
|
| 25 |
J. M. Kim, K. Yasuda and K. Fujimoto, J. Electron. Mater., 34-5 (2005), 600
DOI
ScienceOn
|
| 26 |
J. C. Jagt, IEEE Trans. CPMT Part A, 21-2 (1998), 215
|
webmaster
