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http://dx.doi.org/10.5781/KWJS.2007.25.2.016

Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement  

Hong, Won-Sik (전자부품연구원 신뢰성평가센터)
Oh, Chul-Min (전자부품연구원 신뢰성평가센터)
Park, Noh-Chang (전자부품연구원 신뢰성평가센터)
Song, Byung-Suk (전자부품연구원 신뢰성평가센터)
Jung, Seung-Boo (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
Publication Information
Journal of Welding and Joining / v.25, no.2, 2007 , pp. 16-23 More about this Journal
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Times Cited By KSCI : 1  (Citation Analysis)
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2 W. S. Hong, S. B. Jung and K. B. Kim : Analysis Method of Metallic Ion Migration, Journal of KWS, 23-2 (2005), 138-146 (in Korean)   과학기술학회마을
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