Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement |
Hong, Won-Sik
(전자부품연구원 신뢰성평가센터)
Oh, Chul-Min (전자부품연구원 신뢰성평가센터) Park, Noh-Chang (전자부품연구원 신뢰성평가센터) Song, Byung-Suk (전자부품연구원 신뢰성평가센터) Jung, Seung-Boo (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) |
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2 | W. S. Hong, S. B. Jung and K. B. Kim : Analysis Method of Metallic Ion Migration, Journal of KWS, 23-2 (2005), 138-146 (in Korean) 과학기술학회마을 |
3 | J. E. Sohn : IPC-TR-476A Electrochemical Migration: Electrically Induced Failure in Printed Wiring Assemblies, Electrical Migration Task Group of IPC, IL (1997) |
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9 | JEDEC Solid State Technology Association : JESD22-A104 Rev.B, Temperature cycling, JC-14.1 Committee on Reliability Test methods for Packaged Devices JEDEC, Arlington, VA (2000) |
10 | Y. Aoki, H. Tanaka, S. Yamamoto and O. Obata : Evaluation Method for Ion Migration Using Dew Cycle Test(Part 2), Espec Tech. Report, 1 (1996), 23-27 |
11 | W. S. Hong and K. B. Kim : Tafel Characteristics by Electrochemical Reaction of SnAgCu Pb-Free Solder, Korean Journal of Materials Research, 15-8 (2005), 536-542 (in Korean) |