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Application of MEMS Technology in Microelectronic Packaging  

Kim, Jong-Woong (성균관대학교 신소재공학과)
Kim, Dae-Gon (성균관대학교 신소재공학과)
Moon, Won-Chul (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
Moon, Jeong-Hoon (수원과학대학 일렉트로닉스패키징과)
Shur, Chang-Chae (성균관대학교 신소재공학과)
Jung, Seung-Boo (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
Publication Information
Journal of Welding and Joining / v.24, no.2, 2006 , pp. 34-41 More about this Journal
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Times Cited By KSCI : 1  (Citation Analysis)
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