1 |
Flip-chip Bonding Technology and Reliability of Electronic Packaging
/ [Yoon, Jeong-Won;Kim, Jong-Woong;Koo, Ja-Myeong;Ha, Sang-Su;Noh, Bo-In;Moon, Won-Chul;Moon, Jeong-Hoon;Jung, Seung-Boo;] / Journal of Welding and Joining
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2 |
Reliability Evaluation of Electronic Circuit Printed Using Metallic Ink
/ [Koo, Ja-Myeong;Lee, Jong-Bum;Ha, Sang-Su;Kim, Jong-Woong;Noh, Bo-In;Moon, Jeong-Hoon;Won, Sung-Ho;Jung, Seung-Boo;] / Journal of Welding and Joining
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3 |
Ultrasonic Bonding Technology for Flip Chip Packaging
/ [Koo, Ja-Myeong;Kim, Jong-Woong;Yoon, Jeong-Won;Noh, Bo-In;Lee, Chang-Yong;Moon, Jeong-Hoon;Yoo, Choong-Don;Jung, Seung-Boo;] / Journal of Welding and Joining
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4 |
Properties of High Power Flip Chip LED Package with Bonding Materials
/ [Lee, Tae-Young;Kim, Mi-Song;Ko, Eun-Soo;Choi, Jong-Hyun;Jang, Myoung-Gi;Kim, Mok-Soon;Yoo, Sehoon;] / Journal of the Microelectronics and Packaging Society
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5 |
Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging
/ [Yoon, Jeong-Won;Kim, Jong-Woong;Koo, Ja-Myeong;Noh, Bo-In;Jung, Seung-Boo;] / Journal of Welding and Joining
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6 |
Effects of Bonding Conditions on Joint Property between FPCB and RPCB using Thermo-Compression Bonding Method
/ [Lee, Jong-Gun;Ko, Min-Kwan;Lee, Jong-Bum;Noh, Bo-In;Yoon, Jeong-Won;Jung, Seung-Boo;] / Journal of the Microelectronics and Packaging Society
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7 |
Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
/ [Lee, Young-Kyu;Ko, Yong-Ho;Yoo, Se-Hoon;Lee, Chang-Woo;] / Journal of Welding and Joining
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8 |
Numerical Analysis for Thermal-deformation Improvement in TSOP(Thin Small Outline Package) by Anti-deflection Adhesives
/ [Kim, Sang-Woo;Lee, Hai-Joong;Lee, Hyo-Soo;] / Journal of the Microelectronics and Packaging Society
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