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Strength Evaluation of Adhesively Bonded Single-Lap Joints by Ultrasonic Signal Analysis  

Oh Seung-Kyu (현대모비스 안전시스템부)
Jang Chul-Sub (서울정보기능대 산업설비자동화과)
Han Jun-Young (인천기능대 산업설비자동화과)
Lee Won (숭실대학교 기계공학과)
Publication Information
Journal of Welding and Joining / v.22, no.5, 2004 , pp. 32-37 More about this Journal
Abstract
Application of bonding by adhesives can be found in many industries, particularly in advanced technological domains such as aeronautical and space, automobile and electronics industries. Periodic inspection with conventional ultrasonic NDE techniques is capable of indicating the presence and possible location of crack. Continuous ultrasonic attenuation monitoring has potential to supply information. This article discusses the use of pulse-echo ultrasonic testing for the inspection of adhesive bonds between metal sheets. The method is based on the measurement of the reflection coefficient at the metal/adhesive interface. By means of a control experiment it is shown that Quantitative Nondestructive Evaluation in Adhesive Joints are evaluated together with Ultrasonic Testing and Fracture Testing.
Keywords
Adhesively bonded single-lap joints; Non-destructive evaluation; Ultrasonic wave; Strength evaluation; Signal processing method;
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