Evaluation of Metallurgical Characteristics and Strength on Soldered Joint |
이재식
(서울시립대학교 신소재공학과)
정재필 (서울시립대학교 신소재공학과) 김숙환 (포항산업과학연구원 용접센터) |
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Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting, and Vibration Condition
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Solder Joint Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical, and Vibration Condition
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DOI ScienceOn |
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