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Failure Analysis for BGA/CSP Solder Joints
BGA/CSP 불량 분석
김정관
(삼성전자(주) CS 경영센터 신뢰성연구소)
Publication Information
Journal of Welding and Joining
/
v.20, no.3
, 2002 , pp. 37-45
More about this Journal
More about this Journal
Frequency : Bimonthly
Publisher : The Korean Welding and Joining Society
KISTI Subject :
SCOPUS Subject :
Energy (miscellaneous)
,
Materials Science (miscellaneous)
Web of Science Subject :
Metallurgy &metallurgical Engineering
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