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http://dx.doi.org/10.5573/ieek.2013.50.4.203

Impedance and Read Power Sensitivity Evaluation of Flip-Chip Bonded UHF RFID Tag Chip  

Yang, Jeenmo (School of Electronic and Electrical Engineering, Daegu University)
Publication Information
Journal of the Institute of Electronics and Information Engineers / v.50, no.4, 2013 , pp. 203-211 More about this Journal
Abstract
UHF RFID tag designers usually ndde the chip impedance and read power sensitivity value obtained when a tag chip is mounted on a chip pad. The chip impedance, however, is not able to be supplied by chip manufacturer, since the chip impedance is varied according to tag designs and fabrication processes. Instead, the chip makers mostly supply the chip impedances measured on the bare dies. This study proposes a chip impedance and read power sensitivity evaluation method which requires a few simple auxiliary and some RF measuring equipment. As it is impractical to measure the chip impedance directly at mounted chip terminals, some form test fixture is employed and the effect of the fixture is modeled and de-embeded to determine the chip impedance and the read power sensitivity. Validity and accuracy of the proposed de-embed method are examined by using commercial RFID tag chips as well as a capacitor and a resistor the value of which are known.
Keywords
De-embed;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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