1 |
Muhannad S.Bakir and James D.Meindl, "Integrated interconnect technologies for 3D nanoelectronic systems," Artech House, pp. 389-478, 2009.
|
2 |
H.Ishikuro, N.Miura and T.Kuroda, "Wideband inductive-coupling interface for high-performance portable system," in Proc. IEEE Custom Integr. Circuits Conf., pp. 13-20, 2007.
|
3 |
N.Miura et al., "A 1Tb/s 3 W inductive-coupling transceiver for 3D-stacked inter-chip clock and data link," IEEE J.Solid-State Circuits, vol. 42, no. 1, pp. 111-122, Jan. 2007.
DOI
ScienceOn
|
4 |
이장우, 유창식, "인덕티브 커플링 송수신 회로를 위한 신호 전달 기법," 전자공학회 논문지, 제48권 SD편, 제7호, 17-22쪽, 2011년 7월
과학기술학회마을
|
5 |
Robert J.Drost, and Bruce A.Wooley, "An 8-Gb/s/pin simultaneously bidirectional transceiver in 0.35-m CMOS," IEEE J.Solid-State Circuits, vol. 39, no. 11, pp. 1894-1908 Nov. 2004.
DOI
ScienceOn
|
6 |
Y.Sugimori et al., "A 2Gb/s 15pJ/b/chip inductive-coupling programmable bus for NAND flash memory stacking," ISSCC Dig. Tech. Papers, pp.244-246, Feb. 2009.
|
7 |
M.Saito et al., "A 2Gb/s 1.8pJ/b/chip inductive-coupling through-chip bus for 128-die NAND-flash memory stacking," ISSCC Dig. Tech. Papers, pp.440-441, Feb. 2010.
|