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A New Via Structure for Differential Signaling  

Kim, Moon-Jung (Division of Electrical Electronics and Control Engineering, Kongju National University)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.48, no.2, 2011 , pp. 61-66 More about this Journal
Abstract
A new via structure on printed circuit board has been proposed for differential signaling in applications of high-speed interconnection. In new structure, the via is physically separated and then divided into two electrically-isolated sections using mechanical drill routing process. These cutted vias are connected respectively to the traces of the differential pair. New via structure makes possible to rout the differential pair using only one via, while conventional via structure needs two vias for interconnection. Because the spacing even in via region keeps almost constant, new via structure can alleviate an impedance discontinuity and then enhance its signal transmission characteristics such as reflection loss and insertion loss. It is expected that new via structure is effective in differential signaling for high-speed interconnection.
Keywords
Via; Impedance Matching; Differential Signaling; High-Speed Interconnection; Printed Circuit Board;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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