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An Effective Multiple Transition Pattern Generation Method for Signal Integrity Test on Interconnections  

Kim, Yong-Joon (Department of Electrical and Electronic Engineering, Yonsei University)
Yang, Myung-Hoon (Department of Electrical and Electronic Engineering, Yonsei University)
Park, Young-Kyu (Department of Electrical and Electronic Engineering, Yonsei University)
Lee, Dae-Yeal (Department of Electrical and Electronic Engineering, Yonsei University)
Yoon, Hyun-Jun (Department of Electrical and Electronic Engineering, Yonsei University)
Kang, Sung-Ho (Department of Electrical and Electronic Engineering, Yonsei University)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.45, no.1, 2008 , pp. 14-19 More about this Journal
Abstract
Semiconductor testing area challenges many testing issues due to the minimization and ultra high performance of current semiconductors. Among these issues, signal integrity test on interconnections must be solved for highly integrated circuits like SoC. In this paper, we propose an effective pattern application method for signal integrity test on interconnects. Proposed method can be applied by using boundary scan architecture and very efficient test can be preceded with pretty short test time.
Keywords
Signal integrity; Integrated circuit interconnections; IEEE 1149.1; IEEE 1500;
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  • Reference
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