Browse > Article

Signal transient simulation of multi-coupledm frequency-variant transmission lines  

Cho, Young-Il (Hanyang University, Dep. Of Electrical and Computer Engineering)
Eo, Yung-Seon (Hanyang University, Dep. Of Electrical and Computer Engineering)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.43, no.12, 2006 , pp. 89-101 More about this Journal
Abstract
Frequency-variant transmission line parameters are determined. Then the signal transient characterizations of frequency-dependent multi-coupled lines are investigated. With the proposed method, an accurate signal integrity degradation such as signal ringing (overshoot, undershoot) and crosstalk noises relevant to the switching patterns of signals, rising / falling time(tr, tf) and line lengths is investigated. It is shown that there may be approximately 26% discrepancy of signal transients and 260% difference of crosstalk noises between the constant RLC model and frequency-variant RLC model in on-chip global interconnects while those of package lines are 11% and 70%, respectively.
Keywords
전송선;크로스특;시그널 인테그러티;고주파 효과;모드 분석;
Citations & Related Records
연도 인용수 순위
  • Reference
1 K.D.Granzow, Digital Transmission Lines, New York: Oxford Univ, Press, pp.133-168, 1998
2 Howard W. Johnson and Martin Graham, 'High-speed digital design (A handbook of black magic),' Prentice Hall PTR, New Jersey, pp.151-155, 1993
3 S. Shin and Y. Eo, 'Non-physical pseudo-wave- based modal decoupling technique of multi-coupled co-planar transmission lines with homogeneous dielectric media,' in Proc. ISQED., vol. 7, pp. 278-283, Mar. 2006   DOI
4 Y. Eo and W. R. Eisenstadt, 'Generalized coupled interconnect transfer function and high-speed signal simulations,' IEEE Trans. Microwave Theory Tech.,vol. 43, pp. 1115-1121, May 1995   DOI   ScienceOn
5 H. You and M. Soma, 'Crosstalk analysis of interconnection lines and packages In high-speed integrated circuits,' IEEE Trans. Circuits Syst., vol. 37, pp, 1019-1026, Aug. 1990   DOI   ScienceOn
6 H. You and M. Soma, 'Crosstalk analysis of high-speed interconnects and packages,' IEEE Trans. Custom Integrated Circuits Conf., May. 1990   DOI
7 Y. Ikawa, W. R. Eisenstadt, and R. W. Dutton, 'Modeling of high-speed, large-signal transistor switching transients form S-parameter measurements,' IEEE Trans. Electron Devices, vol. ED 29, pp. 669-675, Apr. 1982   DOI   ScienceOn
8 Y. Eo and W. R. Eisenstadt, 'S-parameter-measurement-based high-speed signal transient characterization of VLSI interconnects on SiO2-Si substrate,' IEEE Trans. Adv. Packag., vol. 23, pp.470-479, Aug. 2000   DOI   ScienceOn
9 Y. Eo and W. R. Eisenstadt, 'Simulation an measurements of picosecond signal transients, propagation, and crosstalk on lossy VLSI interconnect,' IEEE Trans. Comp., Packag., Manuaa, Technol. B, vol. 18, pp.215-225, Mar. 1995   DOI   ScienceOn
10 A. Deutsch et al., 'When are transmission-line effects important for on-chip interconnections?,' IEEE Trans. Microwave Theory Tech, vol. 45, pp. 1836-1997, Oct. 1997   DOI   ScienceOn
11 A. Deutsch et al., 'On-chip wiring design challenges for gigahertz operation,' Pro. IEEE, vol. 89, pp. 529-555, Apr. 2001   DOI   ScienceOn
12 Y. I. Ismail, E. G. Friedman, and J. L. Neves, 'Equivalent Elmore delay for RLC trees,' IEEE Trans. Computer-Aided Design, vol. 19, pp. 83-97, Jan. 2000   DOI   ScienceOn
13 Y. Cao et al., 'A new analytical delay and noise model for on-chip RLC interconnect,' in Proc Int. Electron Devices Meeting (IEDM), pp.823-826, Dec. 2000   DOI
14 R. Venkatesan, J. A. Davis, and J. D. Meindl, 'Compact distributed RLC interconnect models-part III:transients in single and coupled lines with capacitive load termination,' IEEE Trans. Electron Devices., vol. 50, pp.1081-1093, Apr. 2003   DOI   ScienceOn
15 Enno Grotelschen, Lohit S. Dutta and Zaage, 'Quasi-analytical analysis of the broadband properties of multiconductor transmission lines on semiconducting substrates,' IEEE Trans. Components, Packaging, Manufact. Tech., vol. 17, pp.376-382, Aug. 1994   DOI
16 Enno Grotelschen, Lohit S. Dutta and Zaage, 'Full-wave analysis and analytical formulas for the line parameters of transmission lines on semiconductor substrates,' INTERGRATION, VLSI J., vol. 16, pp.33-58, 1993   DOI   ScienceOn
17 'International Technology Roadmap for Semiconductors,' SIA Report, 2003
18 Uwe Arz, Hartmut. Grabinski and Dylan F. Williams, 'Influence of the substrate resistivity on the broadband propagation characteristics of silicon transmission lines,' US Government work