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Design of Miniaturized Magnetic Field Probe for Measurement of IC Surface Current Distribution  

Lee, Seung-Bae (School of Information and Communication Engineering, Sungkyunkwan University, Semiconductor Division, Samsung Electronics)
Jeon, Young-Hyun (Semiconductor Division, Samsung Electronics)
Kim, Byung-Sung (School of Information and Communication Engineering, Sungkyunkwan University)
Publication Information
Journal of the Institute of Electronics Engineers of Korea TC / v.46, no.5, 2009 , pp. 154-161 More about this Journal
Abstract
Recently, as many functional blocks are integrated on a small area the high speed integrated circuits emerge as a critical electromagnetic interferer which causes mal-function of adjacent circuitries and lowers the sensitivity of the wireless receivers. Therefore, it is necessary to devise an precise analyzing tool to pinpoint the major electromagnetic noise contributor among the internal circuit blocks of high speed IC's. This paper presents the design, fabrication, and measurement results of the high resolution magnetic field probe which can measure the current density on the IC surface. In order to achieve the high resolution, the magnetic field probe is fabricated using 3-metal semiconductor process so that its thickness is reduced by 10% than that of conventional works. Through the magnetostatic analysis and EM simulation, spatial resolution and sensitivity to the nonmagnetic field components are analyzed. Experimentally, it is found that the fabricated probe can measure the current density on the IC surface with $210{\mu}m$-spatial-resolution.
Keywords
near field emission;
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