A study on Ar/CF4 Magnetized Inductively Coupled Plasma Using Fluid Simulation
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Kim, Yun-Gi
(Dept. of Electrical and Computer Engineering, Pusan National University)
Son, Eui-Jeong (Dept. of Electrical and Computer Engineering, Pusan National University) Wi, Sung-Suk (Dept. of Electrical and Computer Engineering, Pusan National University) Kim, Dong-Hyun (Dept. of Electrical and Computer Engineering, Pusan National University) Lee, Ho-Jun (Dept. of Electrical and Computer Engineering, Pusan National University) |
1 | Roger A. Svehla “ESTIMATED VISCOSITIES AND THERMAL CONDUCTIVITIES OF GASES AT HIGH TEMPERATURES” NASA Technical Report, 132 (1962) |
2 | G J M Hagelaar and L C Pitchford “Solving the Boltzmann equation to obtain electron transport coefficients and rate coefficients for fluid models” Plasma Sources Sci. Technol, 14, 722–733 (2005) DOI ScienceOn |
3 | Soon-Youl So, Akinori Oda, Hirotake Sugawara and Yosuke Sakai “Transient behaviour of CF4 rf plasmas after step changes of power source voltage” J. Phys. D: Appl. Phys, 34, 1919 (2001) DOI ScienceOn |
4 | Bruce E. Poling, John M. Prausnitz, John P. O’Connell “THE PROPERTIES OF GASES AND LIQUIDS” McGRAW-HILL (2001) |
5 | Dennis M. Manos, Daniel L. Flamm “Plasma Etching: An Introduction” Academic press, San Diego (1989) |
6 | V. Tarnovsky, P. Kurunczi, D. Rogozhnikov1, K. Becker “Absolute cross sections for the dissociative electron impact ionization of the CFx(x = 1−3) free radicals” International Journal of Mass Spectrometry and Ion Processes, 128, 181 (1993) DOI ScienceOn |
7 | I. Rozum, P. Limão-Vieira, S. Eden, J. Tennyson, and N. J. Mason “Electron Interaction Cross Sections for CF3I, C2F4, and CFx (x=1–3) Radicals” J. Phys. Chem. Ref, 35, 267 (2006) |
8 | T. Kimura and K. Ohe “Model and probe measurements of inductively coupled CF4 discharges” J. Appl. Phys, 92, 1780 (2002) DOI ScienceOn |
9 | V. Tarnovsky and K. Becker “Absolute partial cross sections for the parent ionization of the CFx(x=1–3) free radicals by electron impact” J. Chem. Phys, 98, 7868 (1993) DOI ScienceOn |
10 | E. Meeks, R. S. Larson, S. R. Vosen and J. W. Shon “Modeling Chemical Downstream Etch Systems for NF3/02 Mixtures” J. Electrochem. Soc, 144, 357 (1997) DOI |
11 | E Brook, M F A Harrison and A C H Smith, “Measurements of the electron impact ionisation cross sections of He, C, O and N atoms” J. Phys. B: Atom. Molec. Phys, 11, 3115 (1978) DOI ScienceOn |
12 | J T Gudmundsson “Global model of plasma chemistry in a low-pressure O2/F2 discharge” J. Phys. D: Appl. Phys, 35, 328 (2002) DOI ScienceOn |
13 | Ho-Jun Lee, Yun-Gi Kim “Self-consistent simulation study on magnetized inductively coupled plasma for 450 mm semiconductor wafer processing” Thin Solid Films, 521, 78–82 (2012) DOI ScienceOn |
14 | Plasma Module User’s Guide, COMSOL Multiphysics v4.3b (2013) |
15 | Michael A. Lieberman, Allan J. Lichtenberg “Principles of Plasma Discharges and Materials Processing” John Wiley&Sons (2005) |
16 | Chen-Fu Chien, J.K. Wang, Tzu-Ching Chang, Wen-Chin Wu “Economic Analysis of 450mm Wafer Migration” IEEE, Semiconductor Manufacturing, 1-4 (2007) |
17 |
Tables of Physical and Chemical Constants (16th edition) (1995). 2.1.4 Hygrometry. Kaye and Laby Online. Ver. 1.0 (2005) |
18 |
PHELPS database, |
19 | Alex V. Vasenkov, Xi Li, Gottlieb S. Oehrlein, and Mark J. Kushner “Properties of c-C4F8 inductively coupled plasmas. II. Plasma chemistry and reaction mechanism for modeling of Ar/c-C4F8/O2 discharges” J. Vac. Sci. Technol, A22, 511 (2004) |
20 | Russell A. BONHAM “Electron Impact Cross Section Data for Carbon Tetrafluoride” Jpn. J. Appl. Phys, 33, 4157 (1994) DOI |
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