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http://dx.doi.org/10.4491/KSEE.2012.34.7.459

Performance Improvement of Dielectric Barrier Plasma Reactor for Advanced Oxidation Process  

Kim, Dong-Seog (Department of Environmental Science, Catholic University of Daegu)
Park, Young-Seek (Faculty of Liberal Education, Daegu University)
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Abstract
In order to improved treatment performance of dielectric barrier discharge (DBD) plasma, plasm + UV process and gas-liquid mixing method has been investigated. This study investigated the degradation of N, N-Dimethyl-4-nitrosoaniline (RNO, indicator of the generation of OH radical). The basic DBD plasma reactor of this study consisted of a plasma reactor (consist of quartz dielectric tube, titanium discharge (inner) and ground (outer) electrode), air and power supply system. Improvement of plasma reactor was done by the combined basic plasma reactor with the UV process, adapt of gas-liquid mixer. The effect of UV power of plasma + UV process (0~10 W), gas-liquid mixing existence and type of mixer, air flow rate (1~6 L/min), range of diffuser pore size (16~$160{\mu}m$), water circulation rate (2.8~9.4 L/min) and UV power of improved plasma + UV process (0~10 W) were evaluated. The experimental results showed that RNO degradation of optimum plasma + UV process was 7.36% higher than that of the basic plasma reactor. It was observed that the RNO decomposition of gas-liquid mixing method was higher than that of the plasma + UV process. Performance for RNO degradation with gas-liquid mixing method lie in: gas-liquid mixing type > pump type > basic reactor. RNO degradation of improved reactor which is adapted gas-liquid mixer of diffuser type showed increase of 17.42% removal efficiency. The optimum air flow rate, range of diffuser pore size and water circulation rate for the RNO degradation at improved reactor system were 4 L/min, 40~$100{\mu}m$ and 6.9 L/min, respectively. Synergistic effect of gas-liquid mixing plasma + UV process was found to be insignificant.
Keywords
Advanced Oxidation Process; Dielectric Barrier Discharge Plasma; Oxidants; Radical; Plasma-UV Process;
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Times Cited By KSCI : 2  (Citation Analysis)
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