Development of Uniform Press for Wafer Bonder
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Lee, Chang-Woo
(Dept. of Ultra Precision Systems, Korea Institute of Machinery & Materials)
Ha, Tae-Ho (Dept. of Ultra Precision Systems, Korea Institute of Machinery & Materials) Lee, Jae-Hak (Dept. of Ultra Precision Systems, Korea Institute of Machinery & Materials) Kim, Seung-Man (Dept. of Ultra Precision Systems, Korea Institute of Machinery & Materials) Kim, Yong-Jin (Dept. of Ultra Precision Systems, Korea Institute of Machinery & Materials) Kim, Dong-Hoon (Dept. of Ultra Precision Systems, Korea Institute of Machinery & Materials) |
1 | Yole Development Report, 2012 "Equipment & Materials for 3DIC and Wafer-Level_Packaging." |
2 | Yole Development Report, 2011 "Thin Wafer Manufacturing Equipment & Materials Markets." |
3 | Morrow, P., Kobrinsky, M., Harmes, M., Park, C., Ramanathan, S., Ramachandrarao, V., Park, H., Kloster, G., List, S. and Kim, S. E., 2004, "Wafer Level 3D Interconnect in Cu Bonding," Proc. AMC, 20, pp. 125-130. |
4 | Lai, M., Li, S., Shih, J. and Chen, K., 2011, "Wafer-Level Three-Dimensional Integrated Circuits (3D IC):Schemes," Microelectron. Eng., 88, pp. 3282-3286. DOI |
5 | Kim, Y., Kang, S. K., Kim, S. and Kim, S. E., 2012, "Wafer Warpage Analysis Of Stacked Wafers for 3D Integration," Microelectron. Eng., 89, pp. 46-49. DOI |
6 | Choi, M. K. and Kim, E., 2008, "Effect of Si Wafer Ultra-Thinning On The Silicon Surface for 3D Integration," J. Microelectron. Packag. Soc., 15(2), pp. 133-137. |
7 | Kim, S. E., 2013, "Manufacturing Yield Challenges For Wafer-To-Wafer Integration," Journal of the Microelectronics & Packaging Society, Vol. 20, No. 1, pp. 1-5. DOI |
8 | Kim, S. D., Kim, S. E., Kang, S. K., Kim, Y. R., Lee, J. E., Kim, E. S., Lim, N. E. and Jung, T. K., 2011, "Wafer level Cu-Cu Bonding Technology for 3D Packaging," 한국생산제조시스템학회 추계학술대회 논문집, p. 48. |
9 | Hyun-Kee Lee, Young-Sik Kand, Nam-Su Park, Sang-Kee Yoon,Jong-Hwan Min, Yeong-Gyu Lee, 2012, "A Study of Au-Au Thermocompression Wafer Bonding," 대한전기학회 하계학술대회 논문집, pp. 18-20. |
10 | Song, J. Y., Kang, J. H., Lee, C. W., Ha, T. H., Jee, W. H. and Kim, W. K., 2005, "Development of Automatic Bonding System for GaAs Wafer," 한국정밀공학회 추계학술대회 논문집. |
11 | Lee, J. H., Song, J. Y., Kim, H. J., Kim, S. M., Ha, T. H., Lee, C. W., 2014, "Study On Pressure Uniformity of Wafer Bonder," 한국정밀공학회 춘계학술대회 논문집, p. 1057. |
12 | http://www.evgroup.com/ko |
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