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http://dx.doi.org/10.3795/KSME-B.2014.38.8.695

Study on the Melting Point Depression of Tin Nanoparticles Manufactured by Modified Evaporation Method  

Kim, Hyun Jin (School of Mechanical and Aerospace Engineering, Korea Aerospace Univ.)
Beak, Il Kwon (School of Mechanical and Aerospace Engineering, Korea Aerospace Univ.)
Kim, Kyu Han (School of Mechanical and Aerospace Engineering, Korea Aerospace Univ.)
Jang, Seok Pil (School of Mechanical and Aerospace Engineering, Korea Aerospace Univ.)
Publication Information
Transactions of the Korean Society of Mechanical Engineers B / v.38, no.8, 2014 , pp. 695-700 More about this Journal
Abstract
In the present study, the melting temperature depression of Sn nanoparticles manufactured using the modified evaporation method was investigated. For this purpose, a modified evaporation method with mass productivity was developed. Using the manufacturing process, Sn nanoparticles of 10 nm size was manufactured in benzyl alcohol solution to prevent oxidation. To examine the morphology and size distribution of the nanonoparticles, a transmission electron microscope was used. The melting temperature of the Sn nanoparticles was measured using a Differential scanning calorimetry (DSC) which can calculate the endothermic energy during the phase changing process and an X-ray photoelectron spectroscopy (XPS) used for observing the manufactured Sn nanoparticle compound. The melting temperature of the Sn nanoparticles was observed to be $129^{\circ}C$, which is $44^{\circ}C$ lower than that of the bulk material. Finally, the melting temperature was compared with the Gibbs Thomson and Lai's equations, which can predict the melting temperature according to the particle size. Based on the experimental results, the melting temperature of the Sn nanoparticles was found to match well with those recommended by the Lai's equation.
Keywords
Evaporation Method; Lead Free Solder; Melting Temperature Depression; Sn Nanoparticle;
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