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http://dx.doi.org/10.3795/KSME-B.2013.37.1.019

Observation of Size Effect and Measurement of Mechanical Properties of Ti Thin Film by Bulge Test  

Jung, Bong-Bu (Dept. of Mechanical Engineering, POSTECH)
Lee, Hun-Kee (Department of Materials Science and Engineering, MIT)
Hwang, Kyung-Ho (SAMSUNG Electronics)
Park, Hyun-Chul (Dept. of Mechanical Engineering, POSTECH)
Publication Information
Transactions of the Korean Society of Mechanical Engineers B / v.37, no.1, 2013 , pp. 19-25 More about this Journal
Abstract
In this study, the mechanical properties of a Ti thin film are measured by a bulge test. In the bulge test, uniform pressure is applied to one side of the film. Measurement of the membrane deflection as a function of the applied pressure allows one to determine the mechanical properties of the film. Ti thin films with thicknesses of 1.0, 1.5, and $2.0{\mu}m$ were deposited on a Si wafer by using an RF magnetron sputtering system. These specimens were annealed at $600^{\circ}C$ for 150, 300, and 600 s to investigate the effect of temperature on the yield stress and mechanical properties of the Ti films. The elastic modulus, residual stress, and yield stress of these membranes are measured by a bulge test. The experimental results suggest that the yield stress is sensitive to the film thickness and annealing time.
Keywords
Bulge Test; Ti Thin Film; Young's Modulus; Residual Stress; Yield Stress;
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