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http://dx.doi.org/10.3795/KSME-A.2012.36.10.1241

Thermal Damage Characterization of Silicon Wafer Subjected to CW Laser Beam  

Choi, Sung-Ho (School of Automotive Engineering, Hanyang Univ.)
Kim, Chung-Seok (School of Automotive Engineering, Hanyang Univ.)
Jhang, Kyung-Young (School of Mechanical Engineering, Hanyang Univ.)
Shin, Wan-Soon (Agency for Defense Development)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.36, no.10, 2012 , pp. 1241-1248 More about this Journal
Abstract
The objective of this study is to evaluate the thermal damage characterization of a silicon wafer subjected to a CW laser beam. The variation in temperature and stress during laser beam irradiation has been predicted using a three-dimensional numerical model. The simulation results indicate that the specimen might crack when a 93-$W/cm^2$ laser beam is irradiated on the silicon wafer, and surface melting can occur when a 186-$W/cm^2$ laser beam is irradiated on the silicon wafer. In experiments, straight cracks in the [110] direction were observed for a laser irradiance exceeding 102 $W/cm^2$. Furthermore, surface melting was observed for a laser irradiance exceeding 140 $W/cm^2$. The irradiance for surface melting is less than that in the simulation results because multiple reflections and absorption of the laser beam might occur on the surface cracks, increasing the absorbance of the laser beam.
Keywords
CW Laser; Silicon Wafer; Crack; Melting;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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1 Cook, R. F., 2006, "Strength and Sharp Contact Fracture of Silicon," Journal of Material Science, Vol. 41, pp. 841-872.   DOI
2 eong, S. M., Park, S. E., Oh, H. S. and Lee, H. L., 2004, "Evaluation of Damage on Silicon Wafers using the Angle Lapping Method and a Biaxial Fracture Strength Test," Journal of Ceramic Processing Research, Vol. 5, No. 5, pp. 171-174.
3 Choi, S. H., Kim, C. S., Jhang, K. Y. and Shin, W. S., 2011, "Influence of Surface Roughness on Morphology of Aluminum Alloy After Pulsed-Laser Irradiation," Trans. of the KSME (A), Vol. 35, No. 9, pp. 1105-1111.   과학기술학회마을   DOI
4 Karnakis, D. M., 2006, "High Power Single-shot Laser Ablation of Silicon with Nanosecond 355 nm," Applied Surface Science, Vol. 252, pp. 7823-7825.   DOI   ScienceOn
5 Said-Bacar, Z., Leroy, Y., Antoni, F., Slaoui, A. and Fogarassy, E., 2011, "Modeling of CW Laser Diode Irradiation of Amorphous Silicon Films," Applied Surface Science, Vol. 257, pp. 5127-5131.   DOI   ScienceOn
6 Yan, J., Sakai, S., Isogai, H. and Izunome, K., 2009, "Recovery of Microstructure and Surface Topography of Grinding-Damaged Silicon Wafers by Nanosecond- Pulsed Laser Irradiation," Semiconductor Science and Technology, Vol. 24, pp. 105018.   DOI   ScienceOn
7 Fu, Z., Wu, B., Gao, Y., Zhou, Y. and Yu, C., 2010, "Experimental Study of Infrared Nanosecond Laser Ablation of Silicon: The Multi-pulse Enhancement Effect," Applied Surface Science, Vol. 256, pp. 2092-2096.   DOI   ScienceOn
8 Jellison, G. E. and Lowndes, D. H., 1982, "Optical Absorption Coefficient of Silicon at 1.152 at Elevated Temperatures," Applied Physics Letters, Vol. 41, pp. 594-596.   DOI
9 Fu, C. J. and Zhang, Z. M., 2006, "Nanoscale Radiation Heat Transfer for Silicon at Different Doping Levels," Journal of Heat and Mass Transfer, Vol. 49, pp. 1703-1718.   DOI   ScienceOn
10 Bass, M., Decusatis, C., Enoch, J., Lakshminarayanan, V., Li, G., Macdonald, C., Mahajan, V. and Stryland, E. V., 2011, Handbook of Optics, 3rd Edition Volume IV, McGraw-Hill, New York.
11 Hull, R., 1999, Properties of Crystalline Silicon, INSPEC, London.
12 Ravindra, N. M., Sopori, B., Gokce, O. H., Cheng, S. X., Shenoy, A., Jin, L., Abedrabbo, S., Chen, W. and Zhang, Y., 2001, "Emissivity Measurements and Modeling of Silicon-Related Materials: An Overview," Journal of Thermophysics, Vol. 22, No. 5, pp. 1593-1611.   DOI
13 Arora, V. K. and Dawar, A. L., 1996, "Laser-induced Damage Studies in Silicon and Silicon-based Photodetectors," Applied Optics, Vol. 35, No. 36, pp. 7061-7065.   DOI
14 Kim, K. W., Lee, J. H., Suh, J. and Cho, H. Y., 2007, "Finite Element Analysis for Prediction of Band Shape of Nd:YAG Laser Fillet Welding," Trans. of the KSME (A), Vol. 31, No. 8, pp. 839-846.
15 Wang, X., Shen, Z. H., Lu, J. and Ni, X. W., 2010, "Laser-induced Damage Threshold of Silicon in Millisecond, Nanosecond, and Picosecond Regimes," Journal of the Applied Physics, Vol. 108, pp. 033103.   DOI   ScienceOn
16 Rogalski, A., 2010, Infrared Detectors, 2nd edition, CRC Press, Boca Raton.
17 Wang, X., Qin, Y., Wang, B., Zhang, L., Shen, Z., Lu, J. and Ni, X., 2011, "Numerical and Experimental Study of the Thermal Stress of Silicon Induced by a Millisecond Laser," Applied Optics, Vol. 50, No. 21, pp. 3725-3732.   DOI
18 Gross, T. S., Hening, S. D. and Watt, D. W., 1991, "Crack Formation During Laser Cutting of Silicon," Journal of Applied Physics, Vol. 69, No. 2, pp. 983-989.   DOI
19 Li, D. H., Zheng, X. J., Wu, B. and Zhou, Y. C., 2009, "Fracture Analysis of a Surface Through-Thickness Crack in PZT Thin Film under a Continuous Laser Irradiation," Engineering Fracture Mechanics, Vol. 76, pp. 525-532.   DOI   ScienceOn
20 Murr, L. E. and Szilva, W. A., 1975, "Laser-Induced Fracture in Silicon," Journal of Materials Science, Vol. 10, pp. 1536-1548.   DOI
21 Conde, J. C., Martín, E., Gontad, F., Chiussi, S., Fornarini, L. and León, B., 2010, "Numerical Analysis of Temperature Profile and Thermal-Stress During Excimer Laser Induced Heteroepitaxial Growth of Patterned Amorphous Silicon and Germanium Bilayers Deposited on Si(100)," Thin Solid Films, Vol. 518, pp. 2431-2436.   DOI   ScienceOn
22 Lee, H. H., Gwak, M. C., Choi, J. H. and Yoh, J. I., 2008, "High Power Laser Driven Shock Compression of Metals and Its Innovative Applications," Trans. of the KSME (B), Vol. 32, No. 11, pp. 832-840.   과학기술학회마을   DOI   ScienceOn
23 Zorba, V., Boukos, N., Zergioti, I. and Fotakis, C., 2008, "Ultraviolet Femtosecond, Picosecond and Nanosecond Laser Microstructuring of Silicon: Structural and Optical Properties," Applied Optics, Vol. 47, No. 11, pp. 1846-1850.   DOI
24 Kalisky, Y. and Kalisky, O., 2011, "Applications and Performance of High Power Lasers and in the Battlefield," Optical Materials, Vol. 34, pp. 457-460.   DOI   ScienceOn