1 |
Lee, M., 1998, 'Finite Element Modeling of Printed Circuit Boards (PCBs) for Structural Analysis,' Soldering & Surface Mount, Vol. 10, No. 3, pp. 12-17
DOI
ScienceOn
|
2 |
Rao R. Tummala, 2001, 'Microsystems Packaging,' McGraw Hill, pp. 879-923
|
3 |
Ding, H. I., Ume, C., Powell, R. E. and Hanna, C. R., 2005, 'Parametric Study of Warpage in Printed Wiring Board Assemblies, Components and Packaging Technologies,' IEEE Transactions on, Vol. 28, No. 3, p. 517
DOI
ScienceOn
|
4 |
Hutapea, P., Grenestedt, J. L., Modi, M., Mello, M., and Frutschy, K., 2006, ' Prediction of Microelectronic Substrate Warpage Using Homogenized Finite Element Models,' Microelectronic Engineering 83, pp 557-569
DOI
ScienceOn
|
5 |
http://en.wikipedia.org/wiki/Genetic_algorithms
|
6 |
Hutapea, P. and Grenestedt, J. L., 2003, 'Influence of Electric Artwork on Thermomechanical Properties and Warpage of Printed Circuit Boards,' Journal of Applied Physics, Vol. 94. No. 1, pp 686-696
DOI
ScienceOn
|
7 |
Kim, S. J., Sohn, E. S., Wang, G. H., Son, S. J., Chung, K. S. and Lee, C. H., 2001, 'A Study on the Effectiveness of Dummy Pattern Design Existence in Multi Layer PBGA Application,' 2001 Electronic Components and Technology Conference
DOI
|
8 |
Moaveni, S., 1999, 'Finite Element Analysis, Theory and Application with Ansys,' Prentice Hall, Upper Saddle River, NJ
|
9 |
http://hbga.org/hbga.html
|