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http://dx.doi.org/10.3795/KSME-A.2002.26.7.1270

Evaluation of Thin Film Residual Stress through the Theoretical Analysis of Nanoindentation Curve  

Lee, Yun-Hee (서울대학교 대학원 재료공학부)
Jang, Jae-Il ((주) 프론틱스 연구개발부)
Kwon, Dong-Il (서울대학교 재료공학부)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.26, no.7, 2002 , pp. 1270-1279 More about this Journal
Abstract
Residual stress is a dominant obstacle to efficient production and safe usage of device by deteriorating the mechanical strength and failure properties. Therefore, we proposed a new thin film stress-analyzing technique using a nanoindentation method. For this aim, the shape change in the indentation load-depth curve during the stress-relief in film was theoretically modeled. The change in indentation depth by load-controlled stress relaxation process was related to the increase or decrease in the applied load using the elastic flat punch theory. Finally, the residual stress in thin film was calculated from the changed applied load based on the equivalent stress interaction model. The evaluated stresses for diamond-like carbon films from this nanoindentation analysis were consistent with the results from the conventional curvature method.
Keywords
Nanoindentation Technique; Thin Film Residual Stress; Indentation Load-Depth Curve; Contact Morphology; Load Controlled-Stress Relaxation;
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