[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.9708/jksci.2015.20.9.047

Design and Implementation of Tangible Interface Using Smart Puck System

Bak, Seon Hui (Dept. of Creative ICT Eng., Busan University of Foreign Studies)
Lee, Jeong Bae (Dept. of Computer Eng., Busan University of Foreign Studies)
Kim, Jeong Ho (Dept. of Computer Eng., Hanbat National University)
Lee, Hee-Man (Dept. of Multimedia, Seo-won University)

Publication Information

Journal of the Korea Society of Computer and Information / v.20, no.9, 2015 , pp. 47-53 More about this Journal

Abstract

In this paper, we propose a novel tangible interface system whose system does not use the expensive hardware is introduced. This proposed tangible interface is used on the table top capacitive multi touch-screen. The tangible interface apparatus which is called smart puck has sanguine arduino compatible board. The board has a Cds photo-sensing sensor and the EPP8266 WiFi module. The Cds sensor decodes the photometric PWM signals from the system and sends corresponding information to the system via TCP/IP. The system has a server called MT-Server to communicate with the smart pucks. The tangible interface shows reliable operation with fast response that is compatible to the expensive traditional devices in the market.

Keywords

Tangible Interface; Smart Puck; Capacitive Screen; Table Top Screen; Multi Touch-Screen;

Citations & Related Records

Reference

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