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A Study on Transient Numerical Simulation on Heat Transfer Characteristics in the Resistive SFCL  

Kim Chul-Ho (Seoul National University of Technology)
Lee Kee-Man (Namdo Provincial College)
Ryu Kyung-Woo (Chonnam National University)
Publication Information
Progress in Superconductivity and Cryogenics / v.7, no.4, 2005 , pp. 14-19 More about this Journal
Abstract
A transient numerical simulation was conducted to have variation of temperature on an element of resistive Superconducting Fault Current Limiter (SFCL) under quench condition. It is very important engineering information for an optimum design of cryogenic system for cooling of a resistive SFCL element. A bifilar coil for resistive SFCL for 10 MVA system was incorporated as a model in this numerical study. From the numerical simulation result, it was found that the averaged temperature on the shunt and Bi-2212 element at 500 kW, 100 ms was 711.1 K and 198.4 K respectively. The temperature variation with the change of the hot-spot size and time is also obtained. The maximum temperature was continuously increased in all cases until the hot-spot stops at 100ms and it was going down after then. Such as, the details of temperature distribution on the SFCL element obtained from this numerical study and it should be very valuable information on the decision of the cooling capacity of cryogenic system.
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