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http://dx.doi.org/10.4150/KPMI.2019.26.3.243

Atomic Layer Deposition for Powder Coating  

Choi, Seok (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
Han, Jeong Hwan (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
Choi, Byung Joon (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
Publication Information
Journal of Powder Materials / v.26, no.3, 2019 , pp. 243-250 More about this Journal
Abstract
Atomic layer deposition (ALD) is widely used as a tool for the formation of near-atomically flat and uniform thin films in the semiconductor and display industries because of its excellent uniformity. Nowadays, ALD is being extensively used in diverse fields, such as energy and biology. By controlling the reactivity of the surface, either homogeneous or inhomogeneous coating on the shell of nanostructured powder can be accomplished by the ALD process. However, the ALD process on the powder largely depends on the displacement of powder in the reactor. Therefore, the technology for the fluidization of the powder is very important to redistribute its position during the ALD process. Herein, an overview of the three types of ALD reactors to agitate or fluidize the powder to improve the conformality of coating is presented. The principle of fluidization its advantages, examples, and limitations are addressed.
Keywords
Atomic layer deposition; Coating; Surface modification; Fluidization; ALD reactor;
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