Browse > Article
http://dx.doi.org/10.4150/KPMI.2011.18.2.176

Influence of Processing Conditions on PVDF Properties  

Lebedev, S.M. (High-Voltage Research Institute of National Research Tomsk Polytechnic University)
Gefle, O.S. (High-Voltage Research Institute of National Research Tomsk Polytechnic University)
Semenikhin, M.V. (High-Voltage Research Institute of National Research Tomsk Polytechnic University)
Publication Information
Journal of Powder Materials / v.18, no.2, 2011 , pp. 176-180 More about this Journal
Abstract
Study of the main properties of PVDF films produced by two processing technologies such as hot pressing from a melt or solution casting was the aim of this paper. All samples were prepared of as-received PVDF powder. First group of samples was prepared by the hot pressing. Second group of samples was prepared by the solution casting method. PVDF powder was dissolved in dimethylformamide. To characterize properties of samples, different experimental methods such as FRA (dielectric spectroscopy), IR-spectroscopy and DSC/TGA analysis were used in this work. It was found that IR-spectra of both studied groups do not change compared to that for virgin PVDF powder. It confirms that molecular structure is practically independent on the processing technology of samples. The only difference has been found that new band centered at $1723\;cm^{-1}$ appears for samples prepared by the hot pressing method. This absorption band is related with formation of C=C bonds in samples prepared by the hot pressing method in contrast both to PVDF powder and samples prepared by the solution casting method.
Keywords
PVDF; Electrical; Thermal and molecular properties;
Citations & Related Records
연도 인용수 순위
  • Reference
1 M. Benz, W. B. Euler and O. J. Gregory: Langmuir, 17 (2000) 239.
2 R. Gregorio Jr. and R. C. Capitao: J. Mater. Sci., 35 (2000) 299.   DOI   ScienceOn
3 R. Imamura, A. B. Silva and R. Gregorio Jr.: J. Appl. Polym. Sci., 110 (2008) 3242.   DOI   ScienceOn
4 C. J. L. Constantino, A. E. Job and R. D. Simoes: Appl. Spectroscopy, 59 (2005) 275.   DOI   ScienceOn
5 V. Sencadas, V. M. Moreira, S. Lanceros-Mendez, A S. Pouzada and R., Gregorio Jr.: Mater. Sci. Forum, 514/516 (2006) 872.   DOI
6 J. S. Nunes, V. Sencades, A. Wu, A. L. Kholkin, P. M. Vilarinho and S. Lanceros-Mendez: Mater. Sci. Forum, 514/516 (2006) 915.   DOI
7 R. Gregorio Jr.: J. Appl. Polym. Sci., 100 (2006) 3272.   DOI   ScienceOn
8 A. Takeno, N. Okui, T. Kitoh, M. Muraoka, S. Umemoto and T. Sakai: Thin Solid Films, 202 (1991) 213.   DOI   ScienceOn
9 H. Kawai: J. Appl. Phys., 8 (1969) 975.   DOI
10 Y. J. Park, Y. S. Kang and C. Park: European Polymer Journal, 41 (2005) 1002.   DOI   ScienceOn
11 Impedance/Gain-Phase Analyzer 1260 and Dielectric Interface 1296, User guide, (2001).
12 V. Sencadas, C. M. Costa, V. Moreira, J. Monteiro, S. K. Mendiratta, J. F. Mano and S. Lanceros-Mendez: e-Polymers, 2 (2005) 1.
13 J. W. Kim, W. J. Cho and C. S. Ha: J. Polymer Sci. B: Polymer Phys., 40 (2002) 19.   DOI   ScienceOn
14 B. Hilczer, H. Smogor and J. Goslar: J. Mater. Sci., 41 (2006) 117.   DOI
15 A. J. Lowinger: J. Polym. Sci.: Polym. Phys., 18 (2003) 793.