1 |
R. Venkatasubramanian, E. Silvola, T. Colpitts and B. O’Quinn: Science, 413 (2001) 297.
|
2 |
M. Toprak, Y. Zhang and M. Muhammed: Mat. Lett., 57 (2003) 3976.
DOI
ScienceOn
|
3 |
上村欣一, 西田勳夫: 熱電半導體とその應用, 日刊工業 新聞社, 東京 (1988).
|
4 |
D. M. Rowe: CRC Handbook of Thermoelectrics, CRC Press, Inc., New York (1995).
|
5 |
B. Poudel, Q. Hao, Y. Ma, Y. Lan, A. Minnich, B. Yu, X. Yan, D. Wang, A. Muto, D. Vahaee, Z. Chen, J. Liu, M. S. Dresselhaus and G. Chen: Z. Ren, Science, 320 (2008) 634.
DOI
ScienceOn
|
6 |
X. A. Fan, J. Y. Yang, R. G. Chen, W. Zhu and S. Q. Bao: Mat. Sci. Eng. A, 438-440 (2006) 190.
DOI
ScienceOn
|
7 |
J. S. Kim: Bulletin of the Korean Institute of Electrical and Electronic Materials Engineers, 21 (2008) 19 (Korean); 김진상: 전기전자재료, 21 (2008) 19.
|
8 |
Y. Deng, C. Cui, N. Zhang, T. Ji, Q. Yang and L. Guo: J. Solid State Chem., 179 (2006) 1575.
DOI
ScienceOn
|
9 |
Y. Q. Cao, X. B. Zhao, T. J. Zhu, X.B. Zhang and J. P. Tu: Appl. Phys. Lett., 92 (2008) 143106.
DOI
ScienceOn
|