DBM 공정에 의한 구형 솔더볼 분말의 제조기술 연구동향
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송인혁
(한국기계연구원 재료연구부)
한유동 (한국기계연구원 재료연구부) 박환영 (한국기계연구원 재료연구부) 최일동 (한국해양대학교 재료공학과) |
| 1 |
A Study of the coarsening in Tin/Lead Solder
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DOI ScienceOn |
| 2 |
The Role of Surface Oxidation in the Break-Up of Laminar Liquid Metal Jets
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| 3 |
Alloy Design and Evaluation of Sn-Bi-In-Zn Solder through Thermodynamic Calculation
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과학기술학회마을 |
| 4 |
Thermal State of Sn-Pb Droplet in the Droplet-Based Manufacturing Process
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| 5 |
A Study on the Characteristics of Low Pb Sn-5 wt%Pb-1.5 wt%Ag-X%In Solder Alloy
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과학기술학회마을 |
| 6 |
A Study on the Microstructure and Adhesion Properties of Sn-3.5Ag/Alloy 42 Lead-Frame Solder Joint
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과학기술학회마을 |
| 7 |
A Study of Spray Forming Using Uniform Droplet Sprays
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| 8 |
Droplet-Based Manufacturing
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| 9 |
Modeling of Deposit Solidification in Droplet Based Manufacturing
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| 10 |
Characterization of Droplet Flight Path and Mass Flux in Droplet-Base Manufacturing
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| 11 |
Control of the UDS Process for the Production of Solder Balls for BGA Elecrtonics Packaging
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| 12 |
A Study on Interfacial Reaction and Mechanical Properties of 43Sn-57Bi-X Solder and Cu Subsrate
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과학기술학회마을 |
| 13 |
Solder Jet Printing of Micropads and Vertical Interconnect
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| 14 |
Solder Jet Technology Update
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| 15 |
Effects of Droplet Thermal State of Deposit Microstructure in Spay Forming
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DOI ScienceOn |
| 16 |
Contribution to Droplet Break-Up Analysis
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DOI ScienceOn |
| 17 |
Spray Deposition of a Sn-40 wt%Pb Alloy with Uniform Droplet
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