1 |
Y. Liao et al., "Miniaturized Lange Bridge Design for 5G Millimeter Waves Communication", 2019 Int. Appl. Comput. Electromagn. Soc. Symp. Miami ACES-Miami 2019, pp. 1-2, 2019.
|
2 |
C. bunel et al., "Integrated passive devices and tsv a disruptive technology for miniaturization", Proc. Int. Symp. Microelectron., pp. 794-798, 2013.
|
3 |
Ye Lin et al., "Physical Electrical Characterization of 3D Embedded Capacitor: A High-density MIM Capacitor Embedded in TSV", IEEE 67th Proc. - Electron. Compon. Technol. Conf., Orlando, FL, USA, pp. 1956-1961, 2017.
|
4 |
A. Farrcy et al., "Plasma-Assisted ALD of TiN/Al2O3 Stacks for MIMIM Trench Capacitor Applications", ECS Trans., Vol. 25, No.4, pp. 389-397, 2009.
DOI
|
5 |
J. Robertson et al., "High dielectric constant oxides", Eur. Phys, Vol. 28, pp. 265-291, 2004.
|
6 |
T. S. Boscke et al., "Tetragonal Phase Stabilization by Doping as an Enabler of Thermally Stable HfO2 based MIM and MIS Capacitors for sub 50nm Deep Trench DRAM", 2006 Tech. Dig. - Int. Electron Devices Meet., San Francisco, CA, USA, pp. 1-4, 2006.
|
7 |
R. A. Shaheen et al., "Millimeter-wave Frequency Reconfigurable Low Noise Amplifiers for 5G", IEEE Trans. Circuits Syst. II: Express Br., Vol. 68, No. 2, pp. 642-646, 2020.
|
8 |
D. Hoogeland et al., "Plasma-Assisted ALD of TiN/Al2O3 Stacks for MIMIM Trench Capacitor Applications", ECS Trans., Vol. 25, No.4, pp. 389-397, 2009.
DOI
|
9 |
Jun Onohara et al., "Development of the Integrated Passive Device using Through-Glass-Via substrate", 2018 Int. Conf. Electron. Packag. iMAPS All Asia Conf. ICEP-IAAC 2018, Mie, Japan, pp. 19-22, 2018.
|
10 |
M. Thomas et al., "Integration of a high density Ta2O5 MIM capacitor following 3D damascene architecture compatible with copper interconnects", Microelectron. Eng., Vol. 83, No.11-12, pp. 2163-2168, 2006.
DOI
|