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New Mechanism for Wafer Guide to Minimize the Drop in Wafer Transfer  

Kim, Dea-Won (School of Mechanical Engineering, Korea University of Technology and Education)
Ryu, Jee-Hwan (School of Mechanical Engineering, Korea University of Technology and Education)
Publication Information
Journal of the Semiconductor & Display Technology / v.9, no.1, 2010 , pp. 23-28 More about this Journal
Abstract
In this paper, wafer drop from wafer guide mechanism, which is one of the serious problems in water transfer robot, is analyzed, and new wafer guide mechanisms are proposed to minimize this drop. Three types of new wafer guide mechanisms are proposed: roller type, gear type and L-shape rocker type. We choose one of the proposed mechanism, which is roller type, and verified this mechanism through real transfer experiment. Wafer picking up test is conducted with initial aligning error for simulating the wafer drop. Number of drop is compared between conventional mechanism and proposed mechanism. As a result, we can find the proposed mechanism can reduce the number of wafer drop dramatically.
Keywords
Wafer transfer robot; wafer guide; wafer drop; semiconductor equipment;
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