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| 1 |
The Study on the Embedded Active Device for Ka-Band using the Component Embedding Process
Jung, Jae-Woong;Park, Se-Hoon;Ryu, Jong-In;
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The Korean Microelectronics and Packaging Society
, v.28, no.3, pp.1-7,
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| 2 |
Evaluation of 12nm Ti Layer for Low Temperature Cu-Cu Bonding
Park, Seungmin;Kim, Yoonho;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.28, no.3, pp.9-15,
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| 3 |
Long-term Stability of Perovskite Solar Cells with Inhibiting Mass Transport with Buffer Layers
Bae, Mi-Seon;Jeong, Min Ji;Chang, Hyo Sik;Yang, Tae-Youl;
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The Korean Microelectronics and Packaging Society
, v.28, no.3, pp.17-24,
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| 4 |
A Study on 8 × 4 Dual-Polarized Array Antenna for X-Band Using LTCC-Based ME Dipole Antenna Structure
Jung, Jae-Woong;Seo, Deokjin;Ryu, Jong-In;
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The Korean Microelectronics and Packaging Society
, v.28, no.3, pp.25-32,
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| 5 |
Mechanical Property Evaluation of Dielectric Thin Films for Flexible Displays using Organic Nano-Support-Layer
Oh, Seung Jin;Ma, Boo Soo;Yang, Chanhee;Song, Myoung;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.28, no.3, pp.33-38,
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| 6 |
오류정정
한국마이크로전자및패키징학회;
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The Korean Microelectronics and Packaging Society
, v.28, no.3, pp.39-40,
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