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| 1 |
Manufacturing yield challenges for wafer-to-wafer integration
Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.20, no.1, pp.1-5,
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| 2 |
Wafer Level Bonding Technology for 3D Stacked IC
Cho, Young Hak;Kim, Sarah Eunkyung;Kim, Sungdong;
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The Korean Microelectronics and Packaging Society
, v.20, no.1, pp.7-13,
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| 3 |
Thermoelectric Properties of the n-type Bi2(Te0.9Se0.1)3 Processed by Hot Pressing with Dispersion of 0.5 vol% TiO2 Nanopowders
Park, D.H.;Oh, T.S.;
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The Korean Microelectronics and Packaging Society
, v.20, no.1, pp.15-19,
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| 4 |
Packaging Substrate Bending Prediction due to Residual Stress
Kim, Cheolgyu;Choi, Hyeseon;Kim, Minsung;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.20, no.1, pp.21-26,
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| 5 |
Deposition Optimization and Property Characterization of Copper-Oxide Thin Films Prepared by Reactive Sputtering
You, Yil-Hwan;Bae, Seung-Muk;Kim, Young-Hwan;Hwang, Jinha;
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The Korean Microelectronics and Packaging Society
, v.20, no.1, pp.27-31,
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| 6 |
The Effect of Precursor Concentration on ZnO Nanorod Grown by Low-temperature Aqueous Solution Method
Mun, D.H.;Ha, J.S.;
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The Korean Microelectronics and Packaging Society
, v.20, no.1, pp.33-37,
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| 7 |
Effect of Electroplating Parameters on Electrodeposits of Invar Alloy
Kim, Ju-Hwan;Jung, Myung-Won;Yim, TaiHong;Lee, Jae-Ho;
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The Korean Microelectronics and Packaging Society
, v.20, no.1, pp.39-43,
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