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| 1 |
Introduction of TSV (Through Silicon Via) Technology
Yoon, Min-Seung;
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The Korean Microelectronics and Packaging Society
, v.16, no.1, pp.1-6,
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| 2 |
Effect of Multiple Reflows on Mechanical and Electrical Properties of ENIG/Sn-3.5Ag/ENIG Ball Grid Array (BGA) Solder Joint
Sung, Ji-Yoon;Pyo, Sung-Eun;Koo, Ja-Myeong;Yoon, Jeong-Won;Noh, Bo-In;Won, Sung-Ho;Jung, Seung-Boo;
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The Korean Microelectronics and Packaging Society
, v.16, no.1, pp.7-11,
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| 3 |
Development of Battery-free SAW Integrated Microsensor for Real Time Simultaneous Measurement of Humidity and  component
Lim, Chun-Bae;Lee, Kee-Keun;Wang, Wen;Yang, Sang-Sik;
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The Korean Microelectronics and Packaging Society
, v.16, no.1, pp.13-19,
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| 4 |
Electrical Properties of RFID Tag Antenna Fabricated by Si CMOS Process
Lee, Seok-Jin;Park, Seung-Beom;Jung, Tae-Hwan;Lim, Dong-Gun;Park, Jae-Hwan;Kim, Yong-Ho;Mun, Nam-Su;
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The Korean Microelectronics and Packaging Society
, v.16, no.1, pp.21-25,
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| 5 |
A Reliability and warpage of wafer level bonding for CIS device using polymer
Park, Jae-Hyun;Koo, Young-Mo;Kim, Eun-Kyung;Kim, Gu-Sung;
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The Korean Microelectronics and Packaging Society
, v.16, no.1, pp.27-31,
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| 6 |
Drop reliability evaluation of Sn-3.0Ag-0.5Cu solder joint with OSP and ENIG surface finishes
Ha, Sang-Ok;Ha, Sang-Su;Lee, Jong-Bum;Yoon, Jeong-Won;Park, Jai-Hyun;Chu, Yong-Chul;Lee, Jun-Hee;Kim, Sung-Jin;Jung, Seung-Boo;
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The Korean Microelectronics and Packaging Society
, v.16, no.1, pp.33-38,
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| 7 |
Fabrication and Electrical Properties of Piezoelectric Inverter Module using Piezoelectric Transformer
Yoon, Jung-Rag;Lee, Chang-Bae;Woo, Byong-Chul;
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The Korean Microelectronics and Packaging Society
, v.16, no.1, pp.39-43,
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| 8 |
Via Cleaning Process for Laser TSV process
Seo, Won;Park, Jae-Hyun;Lee, Ji-Young;Cho, Min-Kyo;Kim, Gu-Sung;
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The Korean Microelectronics and Packaging Society
, v.16, no.1, pp.45-50,
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