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| 1 |
The Effect of Insulating Material on WLCSP Reliability with Various Solder Ball Layout
Kim, Jong-Hoon;Yang, Seung-Taek;Suh, Min-Suk;Chung, Qwan-Ho;Hong, Joon-Ki;Byun, Kwang-Yoo;
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The Korean Microelectronics and Packaging Society
, v.13, no.4, pp.1-7,
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| 2 |
Analysis of Chip Performance by Core and I/O SSN Noise on DLL Board
Cho, Sung-Gon;Ha, Jong-Chan;Wee, Jae-Kyung;
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The Korean Microelectronics and Packaging Society
, v.13, no.4, pp.9-15,
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| 3 |
Thermo-mechanical Deformation Analysis of Filu Chip PBGA Packages Subjected to Temperature Change
Joo, Jin-Won;Kim, Do-Hyung;
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The Korean Microelectronics and Packaging Society
, v.13, no.4, pp.17-25,
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| 4 |
Thermal Stability Enhancement of Nickel Monosilicides by Addition of Pt and Ir
Yoon, Ki-Jeong;Song, Oh-Sung;
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The Korean Microelectronics and Packaging Society
, v.13, no.4, pp.27-36,
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| 5 |
Surface Roughness of the Electroplated Sn with Variations of Electrodeposition Parameters and Contact Resistance of the Flip-chip-bonded Sn Bumps
Jung, Boo-Yang;Park, Sun-Hee;Kim, Young-Ho;Oh, Tae-Sung;
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The Korean Microelectronics and Packaging Society
, v.13, no.4, pp.37-43,
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| 6 |
The Effects of Current Types on Through Via Hole Filling for 3D-SiP Application
Chang, Gun-Ho;Lee, Jae-Ho;
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The Korean Microelectronics and Packaging Society
, v.13, no.4, pp.45-50,
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| 7 |
Preparation of Polymer Light Emitting Diodes with PFO-poss Organic Emission Layer on ITO/Glass Substrates
Yoo, Jae-Hyouk;Chang, Ho-Jung;
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The Korean Microelectronics and Packaging Society
, v.13, no.4, pp.51-56,
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| 8 |
Cu Filling Characteristics of Trench Vias with Variations of Electrodeposition Parameters
Lee, Kwang-Yong;Oh, Teck-Su;Oh, Tae-Sung;
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The Korean Microelectronics and Packaging Society
, v.13, no.4, pp.57-63,
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| 9 |
The Change of  Sensing Characteristics for Carbon Nanotubes with Growth and Post Treatment Conditions
Lee, R.Y.;
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The Korean Microelectronics and Packaging Society
, v.13, no.4, pp.65-70,
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| 10 |
Fabrication and Characterization of Yellow OLED using GDI602:Rubrene(10%) Material
Jang, Ji-Geun;Kim, Hee-Won;
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The Korean Microelectronics and Packaging Society
, v.13, no.4, pp.71-75,
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| 11 |
Surface Morphology and Thickness Distribution of the Non-cyanide Au Bumps with Variations of the Electroplating Current Density and the Bath Temperature
Choi, Eun-Kyung;Oh, Tae-Sung;Englemann, G.;
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The Korean Microelectronics and Packaging Society
, v.13, no.4, pp.77-84,
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