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| 1 |
UV-nanoimprint Patterning Without Residual Layers Using UV-blocking Metal Layer
Moon Kanghun;Shin Subum;Park In-Sung;Lee Heon;Cha Han Sun;Ahn Jinho;
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The Korean Microelectronics and Packaging Society
, v.12, no.4, pp.275-280,
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| 2 |
In-situ Observation of Electromigration Behaviors of Eutectic SnPb Line
Kim Oh-Han;Yoon Min-Seung;Joo Young-Chang;Park Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.12, no.4, pp.281-287,
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| 3 |
Evaluation and Test Method Characterization for Mechanical and Electrical Properties in BGA Package
Koo Ja-Myeong;Kim Jong-Woong;Kim Dae-Gon;Yoon Jeong-Won;Lee Chang-Yong;Jung Seung-Boo;
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The Korean Microelectronics and Packaging Society
, v.12, no.4, pp.289-299,
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| 4 |
Aging Characteristics of Sn-1.8Bi-0.7Cu-0.6In Solder
Lee Jaesik;Cho Sun-Yun;Lee Young-Woo;Kim Kyoo-Suk;Cheon Chu-Seon;Jung Jae-Pil;
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The Korean Microelectronics and Packaging Society
, v.12, no.4, pp.301-306,
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| 5 |
Electromigration Behaviors of Lead-free SnAgCu Solder Lines
Ko Min-Gu;Yoon Min-Seung;Kim Bit-Na;Joo Young-Chang;Kim Oh-Han;Park Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.12, no.4, pp.307-313,
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| 6 |
COG (Chip On Glass) Bonding Technology for Flat Panel Display Using Induction Heating Body in AC Magnetic Field
Lee Yoon-Hee;Lee Kwang-Yong;Oh Tae-Sung;
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The Korean Microelectronics and Packaging Society
, v.12, no.4, pp.315-321,
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| 7 |
New Packaging and Characteristics of PIN PD for CWDM Transmission
Kang, Jae-Kwang;Chang, Jin-Heyon;
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The Korean Microelectronics and Packaging Society
, v.12, no.4, pp.323-330,
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| 8 |
Thermal Transient Characteristics of Die Attach in High Power LED Package
Kim Hyun-Ho;Choi Sang-Hyun;Shin Sang-Hyun;Lee Young-Gi;Choi Seok-Moon;Oh Yong-Soo;
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The Korean Microelectronics and Packaging Society
, v.12, no.4, pp.331-338,
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| 9 |
Rapid Grain Growth of  Thin Films for Improving Programming Characteristics of Ferroelectric Gate Field Effect Transistor
Lee, Chang-Woo;
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The Korean Microelectronics and Packaging Society
, v.12, no.4, pp.339-343,
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| 10 |
Characteristics of W-C-N Thin Diffusion Barrier for Cu Interconnection
Lee, Chang-Woo;
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The Korean Microelectronics and Packaging Society
, v.12, no.4, pp.345-349,
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| 11 |
Comparison of Shear Strength and Shear Energy for 48Sn-52In Solder Bumps with Variation of Reflow Conditions
Choi Jae-Hoon;Oh Tae-Sung;
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The Korean Microelectronics and Packaging Society
, v.12, no.4, pp.351-357,
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| 12 |
Preparation and Properties of PVP (poly-4-vinylphenol) Gate Insulation Film For Organic Thin Film Transistor
Baek, In-Jae;Yoo, Jae-Hyouk;Lim, Hun-Seung;Chang, Ho-Jung;Park, Hyung-Ho;
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The Korean Microelectronics and Packaging Society
, v.12, no.4, pp.359-363,
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