|
| 1 |
A High Yield Rate MEMS Gyroscope with a Packaged SiOG Process
Lee Moon Chul;Kang Seok Jin;Jung Kyu Dong;Choa Sung-Hoon;Cho Yang Chul;
/
The Korean Microelectronics and Packaging Society
, v.12, no.3, pp.187-196,
|
|
| 2 |
Application of Au-Sn Eutectic Bonding in Hermetic Rf MEMS Wafer Level Packaging
Wang Qian;Kim Woonbae;Choa Sung-Hoon;Jung Kyudong;Hwang Junsik;Lee Moonchul;Moon Changyoul;Song Insang;
/
The Korean Microelectronics and Packaging Society
, v.12, no.3, pp.197-205,
|
|
| 3 |
Adhesion Enhancement of Thin Film Metals on Polyimide Substrates by Bias Sputtering
Kim S. Y.;Jo S. S.;Kang J. S.;Kim Y. H.;
/
The Korean Microelectronics and Packaging Society
, v.12, no.3, pp.207-212,
|
|
| 4 |
The Properties of Polymer Light Emitting Diodes with ITO/PEDOT:PSS/MEH-PPV/Al Structure
Gong, Su-Cheol;Chang, Ho-Jung;
/
The Korean Microelectronics and Packaging Society
, v.12, no.3, pp.213-217,
|
|
| 5 |
Effects of Asymmetric Distribution of Charged Defects on the Hysteresis Curves of Ferroelectric Capacitors
Lee Kang-Woon;Kim Yong-Il;Lee Won-Jong;
/
The Korean Microelectronics and Packaging Society
, v.12, no.3, pp.219-226,
|
|
| 6 |
[  ] Gas Sensing Characteristics of Carbon Nanotubes
Lee R. Y.;
/
The Korean Microelectronics and Packaging Society
, v.12, no.3, pp.227-233,
|
|
| 7 |
Study on Charge Transport in Nanoscale Organic Monolayers for Molecular Electronics Using Liquid Phase Electrodes
Hwang, Jin-Ha;
/
The Korean Microelectronics and Packaging Society
, v.12, no.3, pp.235-241,
|
|
| 8 |
Temperature Measurement of Flip Chip Joints with Peripheral Array of Solder Bumps
Cho Bon-Goo;Lee Taek-Yeong;Lee Jongwon;Kim Jun-Ki;Kim Gangbeom;
/
The Korean Microelectronics and Packaging Society
, v.12, no.3, pp.243-251,
|
|
| 9 |
Electrical Resistivity and Solder-Reaction Characteristics of Ni Films Fabricated by Electroplating
Lee Kwang-Yong;Won Hye-Jin;Jun Sung-Woo;Oh Teck-Su;Byun Ji-Young;Oh Tae-Sung;
/
The Korean Microelectronics and Packaging Society
, v.12, no.3, pp.253-258,
|
|
| 10 |
Mechanical Properties of Ni Films and  Composite Films Fabricated by Electroplating
Jun S. W.;Won H. J.;Lee K. Y.;Lee J. H.;Byun J. Y.;Oh T. S.;
/
The Korean Microelectronics and Packaging Society
, v.12, no.3, pp.259-265,
|
|
| 11 |
Improving Sensitivity of SAW-based Pressure Sensor with Metal Ground Shielding over Cavity
Lee, Kee-Keun;Hwang, Jeang-Su;Wang, Wen;Kim, Geun-Young;Yang, Sang-Sik;
/
The Korean Microelectronics and Packaging Society
, v.12, no.3, pp.267-274,
|
|