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| 1 |
Interfacial Reaction between 42Sn-58 Bi Solder and Electroless Ni-P/Immersion Au UBM during Aging
Cho Moon Gi;Lee Hyuck Mo;Booh Seong Woon;Kim Tae-Gyu;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.95-103,
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| 2 |
Improving Stability and Characteristic of Circuit and Structure with the Ceramic Process Variable of Dualband Antenna Switch Module
Lee Joong-Keun;Yoo Joshua;Yoo Myung-Jae;Lee Woo-Sung;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.105-109,
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| 3 |
Interconnection Process and Electrical Properties of the Interconnection Joints for 3D Stack Package with  Cu Via
Lee Kwang-Yong;Oh Teck-Su;Won Hye-Jin;Lee Jae-Ho;Oh Tae-Sung;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.111-119,
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| 4 |
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Lee Joo Won;Kang Sung K.;Lee Hyuck Mo;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.121-128,
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| 5 |
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
Bae J. S.;Chang G H.;Lee J. H.;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.129-134,
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| 6 |
Effects of Temperature Amplitude and Loading Frequency on Alternating Current - Induced Damage in Cu Thin Films
Park Yeung-Bae;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.135-140,
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| 7 |
A Synthesis of Spherical Shape  Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
Cho Tae-Hwan;Park Seong-Jin;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.141-147,
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| 8 |
Characteristics of Ni/Co Composite Silicides for Poly-silicon Gates
Kim, Sang-Yeob;Jung, Young-Soon;Song, Oh-Sung;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.149-154,
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| 9 |
The Electrical and Optical Properties of Polymer Light Emitting Diode with ITO/PEDOT:PSS/MEH-PPV/Al Structure at Various Concentration of MEH-PPV
Gong Su Cheol;Back In Jea;Yoo Jae Hyouk;Lim Hun Seung;Chang Ho Jung;Chang Gee Keun;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.155-159,
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| 10 |
Preparation and Crystallization Kinetics of Glasses with Ferroelectric Fresnoite Crystal
Lee, Hoi-Kwan;Chae, Su-Jin;Kang, Won-Ho;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.161-166,
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| 11 |
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Lee Shin-Bok;Yoo Young-Ran;Jung Ja-Young;Park Young-Bae;Kim Young-Sik;Joo Young-Chang;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.167-174,
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| 12 |
Broadband  Bit X-band Phase Shifter Using Payallel-Coupled tines
Sung Gyu-Je;Park Hyun-Sik;Kim Dong-Yen;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.175-179,
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| 13 |
Fabrication of Nanostructured Films of Block Copolymers for Nanolithographical Masks
Park Dae-Ho;Sohn Byeong-Hyeok;Jung Jin Chul;Zin Wang-Cheol;
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The Korean Microelectronics and Packaging Society
, v.12, no.2, pp.181-186,
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