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| 1 |
Effect of  Powder Content on the Dielectric Constant of Epoxy/ Composite Embedded Capacitor Films
Cho Sung-Dong;Lee Joo-Yeon;Hyun Jin-Gul;Lee Sang-Yong;Paik Kyung-Wook;
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The Korean Microelectronics and Packaging Society
, v.11, no.2, pp.1-9,
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| 2 |
Micro-Heatsink Fabricated by Electroless Plating
An Hyun Jin;Son Won Il;Hong Joo Hee;Hong Jae-Min;
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The Korean Microelectronics and Packaging Society
, v.11, no.2, pp.11-16,
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| 3 |
Properties of Phosphate Glasses -  Ceramic Composites for Using Dielectric Materials Having Low Temperature Cofired Ceramic(LTCC)
Lee Hoi Kwan;Lee Yong Su;Hwang Sheng-Jian;Kang Won Ho;Kim Hyung Sun;
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The Korean Microelectronics and Packaging Society
, v.11, no.2, pp.17-22,
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| 4 |
Fluxless Bonding Method between Sn and In Bumps Using Ag Capping Layer
Lee Seung-Hyun;Kim Young-Ho;
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The Korean Microelectronics and Packaging Society
, v.11, no.2, pp.23-28,
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| 5 |
Deposition and Characterization of  Stack-Gate Dielectrics Using MOCVD
Lee Taeho;Oh Jaemin;Ahn Jinho;
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The Korean Microelectronics and Packaging Society
, v.11, no.2, pp.29-35,
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| 6 |
Differential Driving of Inverter for High Uniformity LCD TV Backlight
Chun Young Tea;Lim Sungkyoo;
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The Korean Microelectronics and Packaging Society
, v.11, no.2, pp.37-41,
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| 7 |
Development of Dual Band Directional Coupler Applying Multi-layer Structure
Yoo Myong Jae;Yoo Joshua;Park Seong Dae;Lee Woo S.;Kang Nam K.;
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The Korean Microelectronics and Packaging Society
, v.11, no.2, pp.43-47,
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| 8 |
The Tuning of Oscillation Frequency by the Analysis of Characteristics of each Block in Ceramic VCO
Yoo Chan-Sei;Lee Woo-Sung;
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The Korean Microelectronics and Packaging Society
, v.11, no.2, pp.49-52,
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| 9 |
Electromigration Behavior in the 63Sn-37Pb Solder Strip
Lim Seung-Hyun;Choi Jae-Hoon;Oh Tae-Sung;
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The Korean Microelectronics and Packaging Society
, v.11, no.2, pp.53-58,
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| 10 |
A Development of Tapered Metallic Microneedle Array for Bio-medical Application
Che Woo Seong;Lee Jeong-Bong;Kim Kabseog;Kim Kyunghwan;Jin Byung-Uk;
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The Korean Microelectronics and Packaging Society
, v.11, no.2, pp.59-66,
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