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| 1 |
Preparation and Characterization of Heating Element for Inkjet Printer
장호정;노영규;
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The Korean Microelectronics and Packaging Society
, v.10, no.3, pp.1-7,
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| 2 |
Effects of Silica Filler and Diluent on Material Properties of Non-Conductive Pastes and Thermal Cycling Reliability of Flip Chip Assembly
Jang, Kyung-Woon;Kwon, Woon-Seong;Yim, Myung-Jin;Paik, Kyung-Wook;
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The Korean Microelectronics and Packaging Society
, v.10, no.3, pp.9-17,
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| 3 |
Effects of Surface Finishes on the Low Cycle Fatigue Characteristics of Sn-based Pb-free Solder Joints
Lee, Kyu-O;Yoo, Jin;
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The Korean Microelectronics and Packaging Society
, v.10, no.3, pp.19-27,
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| 4 |
Effects of Microstructure on the Creep Properties of the Lead-free Sn-based Solders
Yoo, Jin;Lee, Kyu-O;Joo, Dae-Kwon;
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The Korean Microelectronics and Packaging Society
, v.10, no.3, pp.29-35,
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| 5 |
Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging
정상원;김종훈;김현득;이혁모;
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The Korean Microelectronics and Packaging Society
, v.10, no.3, pp.37-42,
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| 6 |
Recent Technical Trend and Properties on Raw Materials of Substrates for Microelectronic Packages
이규제;이효수;이근희;
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The Korean Microelectronics and Packaging Society
, v.10, no.3, pp.43-55,
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| 7 |
Study of Failure Mechanisms of Wafer Level Vacuum Packaging for MEMG Gyroscope Sensor
좌성훈;김운배;최민석;김종석;송기무;
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The Korean Microelectronics and Packaging Society
, v.10, no.3, pp.57-65,
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| 8 |
SiC Synthesis by Using Sludged Si Power
최미령;김영철;장영철;
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The Korean Microelectronics and Packaging Society
, v.10, no.3, pp.67-71,
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| 9 |
Thermophysical Properties of PWB for Microelectronic Packages with Solder Resist Coating Process
이효수;
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The Korean Microelectronics and Packaging Society
, v.10, no.3, pp.73-82,
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| 10 |
Optoelectronic Properties of Semiconductor-Atomic Superlattice Diode for SOI Applications
서용진;
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The Korean Microelectronics and Packaging Society
, v.10, no.3, pp.83-88,
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| 11 |
Electrical and Mechanical Properties of Cu(Mg) Film for ULSI Interconnect
안재수;안정욱;주영창;이제훈;
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The Korean Microelectronics and Packaging Society
, v.10, no.3, pp.89-98,
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