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| 1 |
Low Temperature Hermetic Packaging by Localized Heating using Forced Potential Scheme Micro Heater
심영대;신규호;좌성훈;김용준;
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The Korean Microelectronics and Packaging Society
, v.10, no.2, pp.1-5,
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| 2 |
Characterization of (Bi,La) Ferroelectric Thin Films on  /Si Substrates by Sol-Gel Method
장호정;황선환;
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The Korean Microelectronics and Packaging Society
, v.10, no.2, pp.7-12,
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| 3 |
Development of LTCC Materials for RF Module
김용철;이경호;
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The Korean Microelectronics and Packaging Society
, v.10, no.2, pp.13-17,
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| 4 |
Fatigue Life Analysis for Solder Joint of Optical Thin Film Filter Device
김명진;이형만;
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The Korean Microelectronics and Packaging Society
, v.10, no.2, pp.19-26,
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| 5 |
A Comparison of RF Properties of Bonding Pad in Flip-Chip Packaging
박현식;성규제;김진성;이진구;
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The Korean Microelectronics and Packaging Society
, v.10, no.2, pp.27-31,
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| 6 |
Textured Surface Epitaxial Base Silicon Solar Cell
장지근;임용규;정진철;
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The Korean Microelectronics and Packaging Society
, v.10, no.2, pp.33-37,
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| 7 |
TEM Analysis of Interfaces between Cr Film Sputtered with RE Bias and Photosensitive Polyimide
조성수;김영호;
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The Korean Microelectronics and Packaging Society
, v.10, no.2, pp.39-47,
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| 8 |
Hydrogen Degradation of Pt/SBT/Si, Pt/SBT/Pt Ferroelectric Gate Structures and Degradation Resistance of Ir Gate Electrode
박전웅;김익수;김성일;김용태;성만영;
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The Korean Microelectronics and Packaging Society
, v.10, no.2, pp.49-54,
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| 9 |
Growth of  Alloy Thin Films by RE-Magnetron Sputter and Evaluation of Structural and Electrical Properties
송대권;이종원;전종한;
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The Korean Microelectronics and Packaging Society
, v.10, no.2, pp.55-59,
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| 10 |
Interfacial Reaction between Ultra-Small 58Bi-42Sn Solder Bump and Au/Ni/Ti UBM for Ultra-Fine Flip Chip Application
Kang, Woon-Byung;Jung, Yoon;Kim, Young-Ho;
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The Korean Microelectronics and Packaging Society
, v.10, no.2, pp.61-67,
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