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1 |
Advanced procedure for estimation of pipeline embedment on soft clay seabed
Yu, S.Y.;Choi, H.S.;Park, K.S.;Kim, Y.T.;Kim, D.K.;
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Techno-Press
, v.62, no.4, pp.381-389,
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2 |
Effect of rapid screening parameters on seismic performance of RC buildings
Ozmen, Hayri B.;Inel, Mehmet;
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Techno-Press
, v.62, no.4, pp.391-399,
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3 |
A novel and simple HSDT for thermal buckling response of functionally graded sandwich plates
Elmossouess, Bouchra;Kebdani, Said;Bouiadjra, Mohamed Bachir;Tounsi, Abdelouahed;
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Techno-Press
, v.62, no.4, pp.401-415,
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4 |
A review and analysis of circular UHPC filled steel tube columns under axial loading
Hoang, An Le;Fehling, Ekkehard;
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Techno-Press
, v.62, no.4, pp.417-430,
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5 |
Dynamic response of thin plates on time-varying elastic point supports
Foyouzat, Mohammad A.;Estekanchi, Homayoon E.;
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Techno-Press
, v.62, no.4, pp.431-441,
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6 |
A piecewise linear transverse shear transfer model for bolted side-plated beams
Li, Ling-Zhi;Jiang, Chang-Jiu;Su, Ray Kai-Leung;Lo, Sai-Huen;
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Techno-Press
, v.62, no.4, pp.443-453,
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7 |
Effects of viscous damping models on a single-layer latticed dome during earthquakes
Zhang, Huidong;Wang, Jinpeng;Zhang, Xiaoshuai;Liu, Guoping;
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Techno-Press
, v.62, no.4, pp.455-464,
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8 |
Topology optimization of the photovoltaic panel connector in high-rise buildings
Lu, Xilin;Xu, Jiaqi;Zhang, Hongmei;Wei, Peng;
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Techno-Press
, v.62, no.4, pp.465-475,
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9 |
Simulations of short- and long-term deflections of flat plates considering effects of construction sequences
Kim, Jae-Yo;Kang, Su-Min;
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Techno-Press
, v.62, no.4, pp.477-485,
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10 |
Patterns between wall pressures and stresses with grain moisture on cylindrical silo
Kibar, Hakan;
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Techno-Press
, v.62, no.4, pp.487-496,
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11 |
Response of self-centering braced frame to near-field pulse-like ground motions
Rahgozar, Navid;Moghadam, Abdolreza S.;Aziminejad, Armin;
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Techno-Press
, v.62, no.4, pp.497-506,
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12 |
A novel evidence theory model and combination rule for reliability estimation of structures
Tao, Y.R.;Wang, Q.;Cao, L.;Duan, S.Y.;Huang, Z.H.H.;Cheng, G.Q.;
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Techno-Press
, v.62, no.4, pp.507-517,
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