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1 |
A study on the accuracy of multi-task learning structure artificial neural network applicable to multi-quality prediction in injection molding process
Lee, Jun-Han;Kim, Jong-Sun;
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Korean Society of Die & Mold Engineering
, v.16, no.3, pp.1-8,
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2 |
A Study on the Effect of Shrinkage on Lens Deformation in Optical Lens Manufacturing Process Using Thermosetting Resin Material
Park, Si Hwan;
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Korean Society of Die & Mold Engineering
, v.16, no.3, pp.9-15,
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3 |
A study on the automatic inspection system for inner diameter and parallelism of automobile hubs
Kang, Byung-Soo;Yoo, Hyeong-Min;
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Korean Society of Die & Mold Engineering
, v.16, no.3, pp.16-21,
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4 |
A study on designing spindle stage using optimization of flexure
Park, Jaehyun;Kim, Hyo-Young;Yoo, Hyeongmin;
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Korean Society of Die & Mold Engineering
, v.16, no.3, pp.22-27,
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5 |
Analysis of the effect of punch wear on shear surfaces in the piercing process
Jeon, Yong-Jun;Kim, Dong-Earn;
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Korean Society of Die & Mold Engineering
, v.16, no.3, pp.28-33,
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6 |
A study on the efficient method of constrained iterative regular expression pattern matching
Seo, Byung-Suk;
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Korean Society of Die & Mold Engineering
, v.16, no.3, pp.34-38,
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7 |
A study on the vibration cutting of high-hardness mold steel
Kim, Jong-Su;
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Korean Society of Die & Mold Engineering
, v.16, no.3, pp.39-43,
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8 |
Flow and Cure Simulation of resin transfer molding process for composites using MoldFlow
Jung, Jae-Sung;Hong, Ji-Seon;Kim, Sun-Kyoung;
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Korean Society of Die & Mold Engineering
, v.16, no.3, pp.44-49,
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9 |
A study on the prediction of optimized injection molding conditions and the feature selection using the Artificial Neural Network(ANN)
Yang, Dong-Cheol;Kim, Jong-Sun;
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Korean Society of Die & Mold Engineering
, v.16, no.3, pp.50-57,
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10 |
Study on Effect of the printing direction and layer thickness for micro-fluidic chip fabrication via SLA 3D printing
Jin, Jae-Ho;Kwon, Da-in;Oh, Jae-Hwan;Kang, Do-Hyun;Kim, Kwanoh;Yoon, Jae-Sung;Yoo, Yeong-Eun;
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Korean Society of Die & Mold Engineering
, v.16, no.3, pp.58-65,
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