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| 1 |
A study on the effect of binder properties on feedstock and micro powder injection molding process
Lee, Won-sik;Kim, Yong-dae;
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Korean Society of Die & Mold Engineering
, v.11, no.3, pp.1-7,
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| 2 |
A Study on The Ultra-precision Polishing Method of Co-Cr-Mo alloy Using MR Fluid Polishing
Shin, Bong-Cheol;Kim, Byung-Chan;Song, Ki-Hyeok;Cho, Myeong-Woo;
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Korean Society of Die & Mold Engineering
, v.11, no.3, pp.8-12,
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| 3 |
Injection molding analysis of smart phone camera VCM housing
Yoon, Seon Jhin;Cho, Yong Moo;
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Korean Society of Die & Mold Engineering
, v.11, no.3, pp.13-18,
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| 4 |
A study on machining method about molybdenum alloy micro fixing part for TEM precision specimen.
Kim, Ki-Beom;Lee, Chang-Woo;Lee, Hae-Jin;Ham, Min-Ji;Kim, Gun-Hee;
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Korean Society of Die & Mold Engineering
, v.11, no.3, pp.19-24,
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| 5 |
A Study of Mold Technology for Manufacturing of CFRTP Parts
Jung, Eui-Chul;Kim, Jong-Sun;Son, Jung-Eon;Yoon, Kyung-Hwan;Lee, Sung-Hee;
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Korean Society of Die & Mold Engineering
, v.11, no.3, pp.25-28,
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| 6 |
Development of µ-PIM standard mold with exchangable insert core in order to manufacture micro pattern
Park, Chi Yoel;Seo, Chan-Yoel;Kim, Yongdae;
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Korean Society of Die & Mold Engineering
, v.11, no.3, pp.29-34,
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| 7 |
A study on development of plastic vial tube for the DNA detection process
Choi, Kyu-wan;La, Moon-woo;Gang, Jung-hee;Chang, Sung-ho;
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Korean Society of Die & Mold Engineering
, v.11, no.3, pp.35-40,
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| 8 |
Development of an intuitive motion-based drone controller
Seok, Jung-Hwan;Han, Jung-Hee;Baek, Jun-Hyuk;Chang, Won-Joo;Kim, Huhn;
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Korean Society of Die & Mold Engineering
, v.11, no.3, pp.41-45,
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| 9 |
A Study on the Deformation Behavior of Material by V-Ring in Fine Blanking Process
Lee, Chun-Kyu;Min, Kyung-Ho;
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Korean Society of Die & Mold Engineering
, v.11, no.3, pp.46-50,
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| 10 |
Optimization of Electro Polishing Processing Conditions for Deburring of Micro Fuel Cell bipolar plate
Chung, Jea-Hwa;Kim, Byung-Chan;Kim, Woon-Young;Cho, Myeong-Woo;
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Korean Society of Die & Mold Engineering
, v.11, no.3, pp.51-55,
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