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| 1 |
Design and Fabrication of USN/RFID Module for Intelligent Wireless Sensor Network
Kang Ey Goo;Chung Hun-Suk;Lee Jun-Hwan;Hyun Deuk Chang;Hwang Sung-Il;Song Bong-Seob;Lee Sang-Hun;Kim Young-Jin;Oh Sang-Ik;Ju Seung-Ho;Lee Se-Chang;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.209-215,
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| 2 |
Switching Characteristics Enhancement of PT Type Power Diode using Proton Irradiation Technique
Kim Byoung-Gil;Choi Sung-Hwan;Lee Jong-Hun;Bae Young-Ho;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.216-221,
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| 3 |
Processing and Properties of RAINBOW Piezoelectric Actuator
Paik Jong-Hoo;Lim Eun-Kyeong;Kim Chang-il;Lee Mi-Jae;Jee Mi-Jung;Choi Byung-Hyun;Kim Sei-Ki;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.222-227,
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| 4 |
Piezoelectric Characteristics of Low temperature Sintering Pb0.76Ca0.24[(Mn1/3Sb2/3)0.04Ti0.96]O3 Ceramics With the Variation of Poling Field
Chung Kwang-Hyun;Yoo Kyung-Jin;Yoo Ju-Hyun;Cho Bong-Hee;Yoon Hyun-Sang;Paik Dong-Soo;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.228-232,
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| 5 |
Dispersion Technique of Alumina Nanoparticles in Transformer Oil
Song Hyunwoo;Choi Cheol;Choi Kyungshik;Oh Jemyung;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.233-239,
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| 6 |
A Study on Temperature Characteristics of Main Transformers using Measurement System
Han Young-Jae;Kim Ki-Hwan;Kim Seog-Won;Mok Jin-Yong;Choi Jung-Sun;Kim Jung-Su;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.240-245,
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| 7 |
Study on Morphology Investigation and Charge-transfer Property of Self-assembled Viologen Monolayers
Park Sang-Hyun;Lee Dong-Yun;Park Jae-Chul;Kwon Young-Soo;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.246-249,
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| 8 |
MWCNTs/V2O5 Nanowire Hetero-junction Actuator Devices
Lee Kang-Ho;Yee Seong-Min;Park So-Jeong;Huh Jung-Hwan;Kim Gyu-Tae;Park Sung-Joon;Ha Jeong-Sook;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.250-254,
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| 9 |
Improvement of Permeation of Applied Multi-layer Encapsulation of Thin Films on Ethylene Terephthalate(PET)
Kim Jong-Hwan;Han Jin-Woo;Kim Young-Hwan;Seo Dae-Shik;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.255-259,
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| 10 |
Simulation of Liquid Crystals Considering Flow Effect
Kim Hoon;Park Woo-Sang;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.260-266,
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| 11 |
A Study on Dip-Pen Nanolithography Process to fabricate Two-dimensional Photonic Crystal for Planar-type Optical Biosensor
Kim Jun-Hyong;Lee Jong-Il;Lee Hyun-Yong;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.267-272,
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| 12 |
Analysis on Current Distribution in Multi-layer HTSC Power Cable with Shield Layer
Lee Jong-Hwa;Lim Sung-Hun;Yim Seong-Woo;Du Ho-Ik;Han Byoung-Sung;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.273-279,
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| 13 |
Sag Behavior of STACIR/AW 410SQmm Overhead Conductor in accordance with the Aging
Kim Shang-Shu;Kim Byung-Geol;Sin Goo-Yong;Lee Dong-Il;Min Byung-Uk;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.280-286,
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| 14 |
Change of Properties by Environment Conditions in Aged ACSR Overhead Conductor
Kim Shang-Shu;Kim Byung-Geol;Jang Tae-In;Kang Ji-Won;Lee Dong-Il;Min Byung-Uk;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.287-291,
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| 15 |
Study on Reactive Non-thermal Plasma Process combined with Metal Oxide Catalyst for Removal of Dilute Trichloroethylene
Han Sang-Bo;Oda Tetsuji;Park Jae-Youn;Park Sang-Hyun;Koh Hee-Seok;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.292-300,
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| 16 |
Determination of an Inelastic Collision Cross Sections for C3F8 Molecule by Electron Swarm Method
Jeon Byung-Hoon;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.19, no.3, pp.301-306,
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