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| 1 |
무소결 및 저온공정에 의한 세라믹 3D 패키징 소재기술
Kim, Hyo-Tae;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.22, no.12, pp.3-10,
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| 2 |
차세대 패키지용 회로기판 소재의 기술동향
Lee, U-Seong;Lee, Hyeong-Gyu;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.22, no.12, pp.11-22,
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| 3 |
Materials for 3-D Packaging
Kim, Jin-Cheol;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.22, no.12, pp.23-29,
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| 4 |
차세대 세라믹 패키징 재료 개발 동향
Yeo, Dong-Hun;Sin, Hyo-Sun;Hong, Yeon-U;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.22, no.12, pp.30-37,
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