|
| 1 |
Electronic Packaging Technology
백경욱;
/
The Korean Institute of Electrical and Electronic Material Engineers
, v.16, no.7, pp.3-13,
|
|
| 2 |
Design of Next Generation High-Speed Package
김정호;
/
The Korean Institute of Electrical and Electronic Material Engineers
, v.16, no.7, pp.14-20,
|
|
| 3 |
환경친화적 무연 솔더링 접합 기술 동향
이혁모;
/
The Korean Institute of Electrical and Electronic Material Engineers
, v.16, no.7, pp.21-27,
|
|